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FDMF301155

Onsemi

FDMF301155 by Onsemi

FDMF301155 by Onsemi is a switching regulator with 33 terminals, operating temperature range of -40 to 125 °C. It features a max output current of 50A, switching frequency of 1500 kHz, and control mode in current-mode. Ideal for automotive applications due to its hybrid technology and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,098 parts In-Stock

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Digiode

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Native Components

USA . 61 parts In-Stock

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$0.039

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AZTECH Wire

Italy . 93 parts In-Stock

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Kulean Microsystems

USA . 8,032 parts In-Stock

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SupplyDigital Components

Austria . 7,477 parts In-Stock

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Kepictronics

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Corphita

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TANS Electronics

Latvia . 927 parts In-Stock

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UHIMA Technologies

Türkiye . 766 parts In-Stock

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Problanco Electronics

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Northwest PG Solutions

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Microchip USA

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Corohmni

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Overview

Elevate your power management solutions with the FDMF301155 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This switching regulator & controllers category product offers unparalleled performance and efficiency for various applications. With a wide range of benefits such as high output current, pulse width modulation control technique, and automotive-grade temperature grade, this product provides exceptional value to customers. Experience the advantages of cutting-edge technology and seamless integration with the FDMF301155 for all your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the switching regulator.

Surface Mount: YES

Allows for easy and space-efficient mounting on PCBs, making it suitable for compact electronic devices.

Maximum Output Current: 50 A

Capable of handling high power requirements, making it suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Can operate reliably in high temperature environments, ideal for industrial or automotive applications.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique for regulating voltage and current, providing stable output for various loads.

Technical Specifications

Switching Regulators & Controllers FDMF301155 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

O/P SUPPLY VOLTAGE= 4.5V TO 24V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-PXMA-N33

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

33

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

50 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1500 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

FDMF301155 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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