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FDG6342L

Onsemi

FDG6342L by Onsemi

FDG6342L by Onsemi is a small outline, thin profile peripheral driver with 6 terminals. It operates in automotive-grade temperatures (-40 to 125°C) and has built-in transient protection. This driver supports a max output current of 1.5A at 8V, making it ideal for buffer or inverter-based applications requiring source and sink current flow control.

Median Price

$0.105

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 70 parts In-Stock

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Chip Stock

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North Shore Components

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Martec Srl

Italy . 2,677 parts In-Stock

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Bristol Electronics

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Digiode

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Vyrian

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Prism Electronics

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Semi Source

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Aranea Global

USA . 500 parts In-Stock

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$0.103

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Continental Prestige Electronics

USA . 5,358 parts In-Stock

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Argo Parts USA

USA . 2,272 parts In-Stock

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Aztec Data Supply Inc.

USA . 75 parts In-Stock

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$12.500

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AZTECH Wire

Italy . 599 parts In-Stock

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$15.776

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Ampacity Inc.

Singapore . 1,427 parts In-Stock

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Perfect Parts

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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Corphita

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Alle Elektronik GmbH

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SupplyDigital Components

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Microchip USA

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UHIMA Technologies

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Supply Digital

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Corohmni

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Overview

Enhance your electronic designs with the FDG6342L by Onsemi, a top-quality peripheral driver that offers unmatched reliability and performance. Manufactured by industry leader Onsemi, this product provides excellent transient protections and a wide range of applications in automotive and other industries. With a small outline and thin profile package design, this device is easy to integrate into your projects. Experience the benefits of the FDG6342L, including a maximum output current of 1.5A and dual terminal position, making it a versatile and valuable asset for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to external factors, making this peripheral driver suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and providing a reliable connection.

Built-in Protections: TRANSIENT

Built-in transient protections safeguard the peripheral driver and connected devices from voltage spikes and fluctuations, enhancing overall system reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this peripheral driver can function efficiently even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in a wide range of temperature conditions.

Maximum Output Current: 1.5 A

The high maximum output current of 1.5 A allows the peripheral driver to drive multiple components effectively, making it versatile for various applications.

Nominal Supply Voltage: 8 V

With a nominal supply voltage of 8 V, this peripheral driver is compatible with standard power sources, simplifying integration into existing systems.

Technical Specifications

Peripheral Drivers FDG6342L attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

FDG6342L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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