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FDG6323L

Onsemi

FDG6323L by Onsemi

FDG6323L by Onsemi is a MOS technology peripheral driver with 6 terminals in a small outline package. It operates at power supplies of 2.5/8V, with a max output current of 0.6A. Ideal for applications requiring buffer or inverter based interface ICs and source flow direction.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Vyrian

USA . 2,965 parts In-Stock

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$0.120

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Chip Stock

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Semi Source

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Prism Electronics

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Digiode

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ARCO, INC.

USA . 3,000 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 1,570 parts In-Stock

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North Shore Components

USA . 1,570 parts In-Stock

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ComSIT Distribution GmbH

Germany . 375 parts In-Stock

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Contempo Components LLC

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Ack Elektronik San.Tic.Ltd.Sti

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Sea View Technologies

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Mentor Electronics Marketing, LLC

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Semtec, LLC

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NPI Materials, Inc.

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Distributors (Availability)

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Native Components

USA . 229 parts In-Stock

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$0.162

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$0.156

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Northwest PG Solutions

USA . 1,068 parts In-Stock

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$0.178

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$0.157

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Component Stockers USA

USA . 572 parts In-Stock

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$99.990

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GreenTree Electronics

Israel . 50,000 parts In-Stock

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Perfect Parts

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Kepictronics

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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SupplyDigital Components

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Andel Nordic

Denmark . 1,682 parts In-Stock

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Problanco Electronics

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Corphita

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Futuretech Components

Singapore . 1,147 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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Corohmni

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Supply Digital

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Kulean Microsystems

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Overview

Unlock the potential of your electronic devices with the FDG6323L by Onsemi. Designed to meet the highest quality standards, this peripheral driver offers unmatched reliability and performance. With applications in a wide range of industries, this product provides unparalleled value and benefits to customers. Experience seamless integration, enhanced functionality, and superior efficiency with the FDG6323L. Trust Onsemi for cutting-edge technology that drives innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Surface Mount: YES

Enables easy and quick installation onto printed circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.5/8

Offers flexibility in power input options, accommodating a range of voltage requirements for various applications.

No. of Terminals: 6

Sufficient number of terminals for connecting with other components, allowing for versatile connectivity options.

Maximum Output Current: 0.6 A

Capable of handling a decent amount of current, making it suitable for driving peripherals with moderate power requirements.

Technology: MOS

Utilizes Metal-Oxide-Semiconductor technology for efficient operation and low power consumption.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface options for driving different types of peripherals, offering compatibility with a wide range of devices.

Technical Specifications

Peripheral Drivers FDG6323L attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.6 A

Nominal Output Peak Current Limit:

.27 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/8

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

FDG6323L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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