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FDG6331L

Onsemi

FDG6331L by Onsemi

FDG6331L by Onsemi is a MOS technology peripheral driver with 6 terminals in a small outline package. It offers built-in transient protection, operates at 1.8/8V, and can handle a max output current of 0.8A. Ideal for applications requiring buffer or inverter-based interface ICs with source flow direction.

Median Price

$0.100

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,670 parts In-Stock

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$0.100

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Chip Stock

USA . 24,500 parts In-Stock

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24,500

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Digiode

USA . 2,742 parts In-Stock

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2,742

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BCID Electronics Ltd.

Israel . 1,140 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,126 parts In-Stock

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ComSIT USA

USA . 1,126 parts In-Stock

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J2 Sourcing AB

Sweden . 300 parts In-Stock

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300

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Bristol Electronics

USA . 250 parts In-Stock

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250

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Atlantic Semiconductor

USA . 250 parts In-Stock

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250

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Connect4Technologies Inc.

Canada . 127 parts In-Stock

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Prism Electronics

USA . 74 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 642 parts In-Stock

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$64.690

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$62.102

642

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$62.102

Northwest PG Solutions

USA . 1,626 parts In-Stock

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$71.159

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

USA . 71,800 parts In-Stock

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Perfect Parts

USA . 23,446 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,375 parts In-Stock

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Problanco Electronics

Mexico . 5,416 parts In-Stock

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TANS Electronics

Latvia . 4,759 parts In-Stock

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Microchip USA

USA . 4,720 parts In-Stock

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4,720

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Kulean Microsystems

USA . 3,478 parts In-Stock

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Corphita

USA . 3,074 parts In-Stock

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Supply Digital

USA . 967 parts In-Stock

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UHIMA Technologies

Türkiye . 317 parts In-Stock

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SupplyDigital Components

Austria . 226 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Enhance your electronic devices with the FDG6331L by Onsemi, a top-tier manufacturer known for delivering superior quality products. This peripheral driver offers reliable built-in transient protections, ensuring optimal performance and longevity. Ideal for a wide range of applications, this compact and efficient component provides a seamless interface for buffer or inverter-based peripheral drivers. Elevate your projects with the value, benefits, and advantages that the FDG6331L brings to the table. Experience innovation at its finest with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and space in the design.

Built-in Protections: TRANSIENT

The built-in transient protection ensures the device is safeguarded against voltage spikes and surges, improving overall reliability.

Power Supplies (V): 1.8/8

Offers flexibility in power supply options, allowing compatibility with various systems and components.

No. of Terminals: 6

Having 6 terminals provides sufficient connectivity options for interfacing with other devices in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package saves space on the PCB, making it suitable for applications with limited board space.

Maximum Output Current: 0.8 A

With a maximum output current of 0.8 A, the peripheral driver can effectively drive external components without overheating or malfunctioning.

Technology: MOS

Utilizing MOS technology ensures efficient operation and low power consumption, making the product energy-efficient.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type allows for versatile applications, providing flexibility in signal processing and control.

Output Current Flow Direction: SOURCE

The source output current flow direction simplifies circuit design and ensures compatibility with existing systems.

Technical Specifications

Peripheral Drivers FDG6331L attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/8

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

FDG6331L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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