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FDD2572-F085

Onsemi

FDD2572-F085 by Onsemi

FDD2572-F085 by Onsemi is a N-CHANNEL power field effect transistor (FET) with a min DS breakdown voltage of 150V. It is designed for switching applications and has a max drain current of 29A. This surface mount transistor has a small outline package style and operates in an enhancement mode.

Median Price

$1.060

Lifecycle Status

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4

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1k+

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Rochester

USA . 13 parts In-Stock

1+ parts

-

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$1.060

1k+ parts

$0.880

10k+ parts

$0.784

13

-

$1.060

$0.880

$0.784

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Digiode

USA . 2,827 parts In-Stock

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$0.824

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-

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2,827

$0.824

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Nova Conductors

Japan . 1,080 parts In-Stock

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$0.936

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1,080

$0.936

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Vyrian

USA . 3,438 parts In-Stock

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3,438

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$0.740

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26

$0.740

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Corphita

USA . 1,872 parts In-Stock

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$0.780

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1,872

$0.780

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Corohmni

South Africa . 212 parts In-Stock

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$0.867

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212

$0.867

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Continental Prestige Electronics

USA . 12,510 parts In-Stock

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$0.936

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$0.918

12,510

$0.936

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$0.918

Argo Parts USA

USA . 8,012 parts In-Stock

1+ parts

$0.936

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-

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8,012

$0.936

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Netroflash

USA . 100 parts In-Stock

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$0.936

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100

$0.936

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AZTECH Wire

Italy . 1,196 parts In-Stock

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$17.469

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1,196

$17.469

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 25,000 parts In-Stock

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Lixinc

USA . 17,318 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 9,548 parts In-Stock

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Perfect Parts

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7,913

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A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

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7,500

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TANS Electronics

Latvia . 6,438 parts In-Stock

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6,438

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Kulean Microsystems

USA . 4,980 parts In-Stock

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4,980

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Problanco Electronics

Mexico . 4,076 parts In-Stock

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4,076

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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SupplyDigital Components

Austria . 2,670 parts In-Stock

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2,670

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Supply Digital

USA . 1,413 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 72 parts In-Stock

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Overview

Discover the FDD2572-F085, a high-quality power field effect transistor (FET) manufactured by Onsemi. With its N-channel configuration and built-in diode, this transistor is perfect for switching applications. Offering a maximum drain current of 4A and a low on-resistance of 0.054 ohm, this product delivers exceptional performance. Its small outline package, gull wing terminals, and matte tin finish ensure easy installation and reliability. Whether you need to enhance your electronic devices or optimize power management systems, the FDD2572-F085 is designed to exceed your expectations. Trust Onsemi's expertise and choose this amazing FET for your next project.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making it suitable for various environments.

Polarity or Channel Type

N-CHANNEL - This type of channel allows for efficient and low resistance current flow, improving the device's performance.

Configuration

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit design and allows for easier connections, making it more convenient to use.

Transistor Application

SWITCHING - Designed specifically for switching applications, this transistor provides fast response times and reliable performance, making it ideal for use in power management systems.

Surface Mount

YES - The surface mount capability enables easy and efficient PCB assembly and reduces the overall size and weight of the device.

Minimum DS Breakdown Voltage

150 V - With a high breakdown voltage, this transistor can withstand high voltage spikes, ensuring robust operation in demanding applications.

Package Shape

RECTANGULAR - The rectangular shape allows for space-efficient placement on the PCB, providing flexibility in design and maximizing board real estate.

Terminal Form

GULL WING - The gull wing terminal form facilitates secure soldering and connection, ensuring reliable electrical contact, even in demanding conditions.

Operating Mode

ENHANCEMENT MODE - This mode enables optimal control and regulation of current flow, enhancing device efficiency and performance.

No. of Elements

1 - With a single element, this transistor offers simplicity in circuit design and ease of use.

Avalanche Energy Rating (EAS)

36 mJ - The high avalanche energy rating ensures the device can handle energy spikes without damage, improving its reliability and longevity.

Maximum Drain Current (Abs) (ID)

29 A - With a high maximum drain current, this transistor can handle high power loads, making it suitable for applications requiring high current switching capabilities.

No. of Terminals

2 - The two terminals provide a straightforward connection, making it easy to integrate the transistor into circuit boards or other electronic devices.

Maximum Power Dissipation (Abs)

135 W - The high power dissipation capacity allows the transistor to handle significant amounts of power without overheating, improving its overall stability and reliability.

Package Style (Meter)

SMALL OUTLINE - The small outline package style enables compact and space-efficient PCB layout, ideal for applications with limited space availability.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - The metal-oxide semiconductor technology ensures low power consumption, high efficiency, and excellent performance characteristics, making it a reliable choice for power management applications.

Maximum Operating Temperature

175 °C - The high maximum operating temperature allows for reliable operation in high-temperature environments, ensuring the transistor's stability and longevity.

Transistor Element Material

SILICON - Silicon is widely used in transistor fabrication due to its excellent electrical properties, making this transistor a reliable choice for various applications.

Minimum Operating Temperature

55 °C - The low minimum operating temperature makes this transistor suitable for a wide range of operating conditions, including extreme cold environments.

Terminal Finish

MATTE TIN - The matte tin terminal finish provides excellent solderability, ensuring a reliable and durable connection to the PCB or other components.

Maximum Drain Current (ID)

4 A - With a high maximum drain current rating, this transistor is well-suited for applications requiring medium power levels, providing versatility for different electronic systems.

Maximum Drain-Source On Resistance

0.054 ohm - The low drain-source resistance minimizes power loss and improves efficiency, making this transistor an excellent choice for power-intensive applications.

Terminal Position

SINGLE - The single terminal position simplifies the connection process and ensures straightforward integration into circuit designs.

Moisture Sensitivity Level (MSL)

1 - The MSL 1 rating indicates that the transistor is not sensitive to moisture, providing increased reliability and stability in various operating conditions.

Case Connection

DRAIN - The drain connection simplifies the transistor's use in specific circuit configurations and improves overall circuit performance.

Maximum Time At Peak Reflow Temperature (s)

30 - This specification indicates the maximum duration the transistor can sustain at the peak reflow temperature without compromising its performance or physical integrity.

Peak Reflow Temperature °C

260 - The high peak reflow temperature ensures a solid solder joint during the assembly process, guaranteeing the transistor's reliability and functionality.

Reference Standard

AEC-Q101 - Complying with the AEC-Q101 standard ensures the transistor's high quality and reliability, making it suitable for automotive applications and other rigorous environments.

Technical Specifications

Power Field Effect Transistors (FET) FDD2572-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

36 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.054 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD2572-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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