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FCHD190N65S3R0-F155

Onsemi

FCHD190N65S3R0-F155 by Onsemi

FCHD190N65S3R0-F155 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has a Max IDM of 42.5A and 0.19 ohm RDS(ON). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 144W.

Median Price

$2.946

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$6.510

100+ parts

$4.730

1k+ parts

$3.690

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2

$6.510

$4.730

$3.690

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DigiKey

USA . 1,170 parts In-Stock

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$2.210

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1,170

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$2.210

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Flip Electronics (Authorized)

USA . 1,170 parts In-Stock

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1,170

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Rochester

USA . 197 parts In-Stock

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$2.780

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$2.490

10k+ parts

$2.340

197

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$2.780

$2.490

$2.340

Verical

USA . 197 parts In-Stock

1+ parts

-

100+ parts

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$3.112

10k+ parts

$2.925

197

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-

$3.112

$2.925

Distributors (In-Stock)

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Vyrian

USA . 958 parts In-Stock

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$2.210

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958

$2.210

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Digiode

USA . 1,811 parts In-Stock

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$2.936

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1,811

$2.936

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Flip Electronics

USA . 1,170 parts In-Stock

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1,170

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Ashlea Components Ltd

UK . 210 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 55 parts In-Stock

1+ parts

$1.522

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55

$1.522

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$2.028

100+ parts

$1.845

1k+ parts

$1.663

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450

$2.028

$1.845

$1.663

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Corphita

USA . 2,033 parts In-Stock

1+ parts

$2.781

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2,033

$2.781

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$3.100

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1

$3.100

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Microchip USA

USA . 2,199 parts In-Stock

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$17.500

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$17.500

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Problanco Electronics

Mexico . 6,308 parts In-Stock

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Kulean Microsystems

USA . 4,670 parts In-Stock

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TANS Electronics

Latvia . 4,248 parts In-Stock

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SupplyDigital Components

Austria . 2,849 parts In-Stock

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Perfect Parts

USA . 1,389 parts In-Stock

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Northwest PG Solutions

USA . 953 parts In-Stock

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Native Components

USA . 883 parts In-Stock

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UHIMA Technologies

Türkiye . 298 parts In-Stock

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Authorized Procurement Solutions

USA . 160 parts In-Stock

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Overview

Experience the superior performance of the FCHD190N65S3R0-F155 by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors (FET). This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering reliable operation and efficient power management. With a minimum DS Breakdown Voltage of 650V and maximum Drain Current of 17A, this transistor provides exceptional value and benefits to customers looking for a dependable solution for their electronic projects. Trust Onsemi for cutting-edge technology and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching operations and protection against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in this specific use case.

Surface Mount: YES

The surface mount capability makes it easy to integrate this FET into compact designs and PCB layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs allow for easier control of the transistor's conductivity, enhancing the switching performance.

Maximum Pulsed Drain Current (IDM): 42.5 A

High pulsed drain current allows for handling spikes in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 76 mJ

A high avalanche energy rating indicates the FET's ability to withstand high-energy spikes without damage.

Maximum Power Dissipation (Abs): 144 W

High power dissipation capability ensures that the FET can handle high power loads without overheating.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate reliably in high-temperature environments.

Minimum Operating Temperature: -55 °C

The FET can also operate in low-temperature conditions, providing versatility in different operating environments.

Maximum Drain-Source On Resistance: 0.19 ohm

Low drain-source on resistance minimizes power loss and heat generation, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FCHD190N65S3R0-F155 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

76 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42.5 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCHD190N65S3R0-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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