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FCHD125N65S3R0-F155

Onsemi

FCHD125N65S3R0-F155 by Onsemi

FCHD125N65S3R0-F155 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has a Max Pulsed Drain Current of 60A and Max Power Dissipation of 181W. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a -55 to 150 °C temperature range.

Median Price

$3.130

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,739 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

4,739

-

$3.130

$2.800

$2.630

Verical

USA . 4,739 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

4,739

-

$3.913

$3.500

$3.288

DigiKey

USA . 4,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.880

10k+ parts

$2.880

4,590

-

-

$2.880

$2.880

Flip Electronics (Authorized)

USA . 4,590 parts In-Stock

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4,590

-

-

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Distributors (In-Stock)

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Vyrian

USA . 2,499 parts In-Stock

1+ parts

$2.880

100+ parts

-

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2,499

$2.880

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Digiode

USA . 549 parts In-Stock

1+ parts

$3.296

100+ parts

-

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549

$3.296

-

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Flip Electronics

USA . 4,590 parts In-Stock

1+ parts

-

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4,590

-

-

-

-

Distributors (Availability)

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Native Components

USA . 191 parts In-Stock

1+ parts

$0.796

100+ parts

-

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-

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191

$0.796

-

-

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Northwest PG Solutions

USA . 1,094 parts In-Stock

1+ parts

$0.875

100+ parts

-

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1,094

$0.875

-

-

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Corohmni

South Africa . 168 parts In-Stock

1+ parts

$2.880

100+ parts

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168

$2.880

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Corphita

USA . 2,306 parts In-Stock

1+ parts

$3.123

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2,306

$3.123

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Component Stockers USA

USA . 4,564 parts In-Stock

1+ parts

$3.520

100+ parts

$3.310

1k+ parts

$2.990

10k+ parts

-

4,564

$3.520

$3.310

$2.990

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Microchip USA

USA . 6,676 parts In-Stock

1+ parts

$19.628

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6,676

$19.628

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Problanco Electronics

Mexico . 7,391 parts In-Stock

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7,391

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TANS Electronics

Latvia . 4,763 parts In-Stock

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4,763

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SupplyDigital Components

Austria . 3,925 parts In-Stock

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Kulean Microsystems

USA . 2,032 parts In-Stock

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2,032

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 691 parts In-Stock

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691

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Overview

Experience the superior quality and reliability of Onsemi's FCHD125N65S3R0-F155 Power Field Effect Transistor. Designed for switching applications, this N-CHANNEL transistor offers a maximum operating temperature of 150 °C and a minimum DS breakdown voltage of 650V, making it ideal for high-power tasks. With a maximum power dissipation of 181W and an avalanche energy rating of 115mJ, this transistor ensures optimal performance and efficiency. Trust in Onsemi's expertise and invest in the FCHD125N65S3R0-F155 for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used in power applications because of their higher electron mobility and conductivity compared to P-Channel FETs.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V makes this FET suitable for high-voltage applications, ensuring reliable performance and protection.

Avalanche Energy Rating (EAS): 115 mJ

The high avalanche energy rating of 115 mJ means this FET can withstand sudden energy spikes, making it suitable for rugged environments.

Maximum Power Dissipation (Abs): 181 W

With a high power dissipation rating of 181W, this FET can handle high power levels efficiently without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers high performance and reliability, making this FET a good choice for demanding applications.

Maximum Operating Temperature: 150 °C

The high operating temperature of 150 °C ensures the FET can operate reliably in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) FCHD125N65S3R0-F155 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

115 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCHD125N65S3R0-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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