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FCD900N60Z

Onsemi

FCD900N60Z by Onsemi

FCD900N60Z by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It features a built-in diode, 13.5A IDM, and 0.9 ohm RDS(on). Ideal for switching applications, this MOSFET operates in enhancement mode with 52W power dissipation and -55 to +150°C temperature range.

Median Price

$1.589

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 1,498 parts In-Stock

1+ parts

$2.400

100+ parts

$1.060

1k+ parts

$0.827

10k+ parts

$0.782

1,498

$2.400

$1.060

$0.827

$0.782

DigiKey

USA . 1,442 parts In-Stock

1+ parts

$2.400

100+ parts

$1.052

1k+ parts

$0.826

10k+ parts

$0.675

1,442

$2.400

$1.052

$0.826

$0.675

Flip Electronics (Authorized)

USA . 9,278 parts In-Stock

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Arrow

USA . 2,500 parts In-Stock

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$1.589

2,500

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$1.589

Verical

USA . 2,500 parts In-Stock

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$0.689

2,500

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$0.689

Rochester

USA . 1,358 parts In-Stock

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$0.963

1k+ parts

$0.799

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$0.712

1,358

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$0.963

$0.799

$0.712

Distributors (In-Stock)

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Digiode

USA . 980 parts In-Stock

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$0.712

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980

$0.712

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Nova Conductors

Japan . 75 parts In-Stock

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$0.828

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75

$0.828

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TME

Poland . 2,286 parts In-Stock

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$1.960

100+ parts

$0.940

1k+ parts

$0.930

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2,286

$1.960

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$0.930

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Cyclops Electronics Ltd

UK . 33,440 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 14,282 parts In-Stock

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Flip Electronics

USA . 9,278 parts In-Stock

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Chip Stock

USA . 9,000 parts In-Stock

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Vyrian

USA . 2,707 parts In-Stock

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DigiKey Marketplace

USA . 1,213 parts In-Stock

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Velocity Electronics

USA . 193 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,848 parts In-Stock

1+ parts

$0.630

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2,848

$0.630

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Semicontronic

India . 2,815 parts In-Stock

1+ parts

$0.630

100+ parts

$0.614

1k+ parts

$0.611

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2,815

$0.630

$0.614

$0.611

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Corphita

USA . 2,300 parts In-Stock

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$0.675

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2,300

$0.675

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Corohmni

South Africa . 84 parts In-Stock

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$0.743

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84

$0.743

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Aztec Data Supply Inc.

USA . 1,383 parts In-Stock

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$0.771

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$0.771

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Component Stockers USA

USA . 7,623 parts In-Stock

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$0.780

100+ parts

$0.730

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$0.660

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7,623

$0.780

$0.730

$0.660

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Argo Parts USA

USA . 1,476 parts In-Stock

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$0.828

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1,476

$0.828

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Microchip USA

USA . 4,095 parts In-Stock

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$5.023

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 16,582 parts In-Stock

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Infinite Electronics LLP (Excess)

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Problanco Electronics

Mexico . 8,235 parts In-Stock

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GreenTree Electronics

Israel . 7,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,508 parts In-Stock

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Kulean Microsystems

USA . 6,138 parts In-Stock

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RC Electronics

USA . 6,000 parts In-Stock

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$0.710

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$0.650

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$0.630

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$0.630

TANS Electronics

Latvia . 5,488 parts In-Stock

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SupplyDigital Components

Austria . 5,146 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 1,840 parts In-Stock

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Continental Prestige Electronics

USA . 1,213 parts In-Stock

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$0.900

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Supply Digital

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UHIMA Technologies

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Kepictronics

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Overview

Enhance your power switching applications with the FCD900N60Z by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET offers unparalleled quality and reliability. From its cutting-edge technology to its robust design, this transistor is a game-changer in the industry. With a maximum operating temperature of 150°C and a minimum DS Breakdown Voltage of 600V, this transistor delivers exceptional performance under any conditions. Whether you're looking for efficiency, durability, or versatility, the FCD900N60Z has got you covered. Trust Onsemi to provide you with the best-in-class solutions for all your power switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable housing for the transistor, allowing for easy handling and ensuring long-term performance.

Polarity or Channel Type: N-CHANNEL

N-channel type transistors typically offer lower on-resistance and higher efficiency, making them a popular choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse voltage, offering added convenience and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast response times and efficient power management.

Surface Mount: YES

Being surface mountable, this FET can be easily integrated onto PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltages, making it suitable for demanding applications that require voltage regulation and protection.

Package Shape: RECTANGULAR

The rectangular shape of the package enables easy mounting and efficient use of board space.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and facilitate automated soldering processes, ensuring reliable operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer precise control over the switching process, allowing for efficient power management and performance optimization.

Maximum Pulsed Drain Current (IDM): 13.5 A

The high pulsed current rating makes this FET suitable for applications that require short bursts of power, ensuring reliable performance under varying loads.

Avalanche Energy Rating (EAS): 47.5 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy transients, ensuring robust protection against voltage spikes.

Maximum Drain Current (Abs) (ID): 4.5 A

The high drain current rating ensures continuous and reliable operation under varying load conditions.

No. of Terminals: 2

With a simple two-terminal configuration, this FET is easy to integrate into existing circuit designs, providing flexibility and versatility.

Maximum Power Dissipation (Abs): 52 W

The high power dissipation rating allows the FET to handle high power levels, making it suitable for demanding applications that require efficient thermal management.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting, making this FET ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-resistance, high switching speeds, and excellent thermal performance, making it a reliable choice for various power applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can perform reliably in harsh environments, ensuring long-term durability and stability.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance, low leakage currents, and high breakdown voltages, making them a reliable choice for power applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and ensures secure connections, enhancing the overall reliability of the FET.

Maximum Drain-Source On Resistance: 0.9 ohm

The low on-resistance minimizes power losses and improves efficiency, making this FET ideal for high-current applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and allows for easy connection, ensuring quick and hassle-free integration into circuit designs.

Case Connection: DRAIN

The drain connection allows for efficient heat dissipation and helps maintain the FET's operating temperature within safe limits, ensuring optimal performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures that the FET can withstand the reflow soldering process without compromising its performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating indicates the FET's ability to withstand the soldering process, ensuring reliable and durable connections.

Technical Specifications

Power Field Effect Transistors (FET) FCD900N60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

47.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

13.5 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCD900N60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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