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FCD9N60NTM

Onsemi

FCD9N60NTM by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 92.6 W; Minimum DS Breakdown Voltage: 600 V; Operating Mode: ENHANCEMENT MODE;

Median Price

$1.548

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 3,090 parts In-Stock

1+ parts

$2.060

100+ parts

$1.450

1k+ parts

$1.100

10k+ parts

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3,090

$2.060

$1.450

$1.100

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Arrow

USA . 2,500 parts In-Stock

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$1.404

2,500

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$1.404

Rochester

USA . 520 parts In-Stock

1+ parts

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$1.520

1k+ parts

$1.260

10k+ parts

$1.120

520

-

$1.520

$1.260

$1.120

Verical

USA . 520 parts In-Stock

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-

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-

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$1.575

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$1.400

520

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$1.575

$1.400

Distributors (In-Stock)

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Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$1.297

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63

$1.297

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Cyclops Electronics Ltd

UK . 5,000 parts In-Stock

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Chip Stock

USA . 2,855 parts In-Stock

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Digiode

USA . 2,852 parts In-Stock

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Vyrian

USA . 2,429 parts In-Stock

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Sensible Micro Corp

USA . 478 parts In-Stock

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478

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Bristol Electronics

USA . 21 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,144 parts In-Stock

1+ parts

$1.190

100+ parts

-

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2,144

$1.190

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Corohmni

South Africa . 227 parts In-Stock

1+ parts

$1.271

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227

$1.271

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Argo Parts USA

USA . 2,925 parts In-Stock

1+ parts

$1.297

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2,925

$1.297

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Netroflash

USA . 100 parts In-Stock

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$1.297

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100

$1.297

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

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$1.515

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$1.515

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Continental Prestige Electronics

USA . 110 parts In-Stock

1+ parts

$2.480

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$1.550

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110

$2.480

$1.550

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Semicontronic

India . 2,351 parts In-Stock

1+ parts

$2.600

100+ parts

$2.535

1k+ parts

$2.522

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2,351

$2.600

$2.535

$2.522

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,954 parts In-Stock

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Perfect Parts

USA . 21,358 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,477 parts In-Stock

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Problanco Electronics

Mexico . 6,079 parts In-Stock

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Microchip USA

USA . 5,724 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,818 parts In-Stock

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SupplyDigital Components

Austria . 4,580 parts In-Stock

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Kulean Microsystems

USA . 3,787 parts In-Stock

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Supply Digital

USA . 1,602 parts In-Stock

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Kepictronics

USA . 1,520 parts In-Stock

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TANS Electronics

Latvia . 979 parts In-Stock

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Corphita

USA . 942 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 45 parts In-Stock

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45

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Technical Specifications

Power Field Effect Transistors (FET) FCD9N60NTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

135 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.385 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

27 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCD9N60NTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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