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FCB099N65S3

Onsemi

FCB099N65S3 by Onsemi

FCB099N65S3 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 75A IDM, and 0.099 ohm RDS(on). Ideal for SWITCHING applications due to its 227W Power Dissipation, -55 to 150 °C Operating Temperature range, and built-in DIODE.

Median Price

$4.822

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 639 parts In-Stock

1+ parts

$6.620

100+ parts

$3.330

1k+ parts

$3.150

10k+ parts

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639

$6.620

$3.330

$3.150

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DigiKey

USA . 345 parts In-Stock

1+ parts

$6.720

100+ parts

$3.326

1k+ parts

$2.717

10k+ parts

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345

$6.720

$3.326

$2.717

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Flip Electronics (Authorized)

USA . 7,962 parts In-Stock

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7,962

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Verical

USA . 2,400 parts In-Stock

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$3.025

10k+ parts

$2.850

2,400

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-

$3.025

$2.850

Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

$2.420

10k+ parts

$2.280

2,400

-

$2.710

$2.420

$2.280

Distributors (In-Stock)

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Vyrian

USA . 1,396 parts In-Stock

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$2.100

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1,396

$2.100

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Digiode

USA . 768 parts In-Stock

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$5.520

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768

$5.520

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Flip Electronics

USA . 8,800 parts In-Stock

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8,800

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Distributors (Availability)

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.687

100+ parts

$0.625

1k+ parts

$0.563

10k+ parts

-

3,000

$0.687

$0.625

$0.563

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Corohmni

South Africa . 549 parts In-Stock

1+ parts

$1.769

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549

$1.769

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Corphita

USA . 767 parts In-Stock

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$5.229

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767

$5.229

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Native Components

USA . 414 parts In-Stock

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$12.572

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414

$12.572

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Northwest PG Solutions

USA . 1,908 parts In-Stock

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$13.829

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$12.446

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1,908

$13.829

$12.446

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Microchip USA

USA . 324 parts In-Stock

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$24.860

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324

$24.860

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Kulean Microsystems

USA . 4,710 parts In-Stock

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TANS Electronics

Latvia . 4,583 parts In-Stock

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Problanco Electronics

Mexico . 3,447 parts In-Stock

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Perfect Parts

USA . 1,658 parts In-Stock

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1,658

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SupplyDigital Components

Austria . 1,422 parts In-Stock

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UHIMA Technologies

Türkiye . 535 parts In-Stock

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535

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Overview

Experience the power of efficiency with the FCB099N65S3 by Onsemi. Crafted with precision and reliability, this Power Field Effect Transistor (FET) offers seamless switching capabilities in a compact package. Ideal for a range of applications, from automotive to industrial settings, this N-CHANNEL transistor provides enhanced performance and durability. Trust in Onsemi's expertise and elevate your projects with the FCB099N65S3 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components of the Power FET.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can provide reverse polarity protection for the load.

Transistor Application: SWITCHING

Suitable for switching applications where high efficiency and fast switching speeds are required.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the FET to handle high voltage applications.

Surface Mount: YES

Easy to solder onto a PCB, saving space and enabling automated assembly processes.

Maximum Pulsed Drain Current (IDM): 75 A

Capable of handling high peak currents for short durations, making it ideal for applications with transient loads.

Avalanche Energy Rating (EAS): 145 mJ

Can handle energy spikes due to avalanche breakdown, improving reliability in high power applications.

Maximum Power Dissipation (Abs): 227 W

High power dissipation capability allows for operation in high power environments without overloading.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.099 ohm

Low on-resistance leads to minimal power loss and heat generation, improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FCB099N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

145 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

75 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB099N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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