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FAM65HR51DS2

Onsemi

FAM65HR51DS2 by Onsemi

FAM65HR51DS2 by Onsemi is an AEC-Q100 compliant power management IC with 16 terminals in a rectangular flange mount package. It operates b/w -40 °C to 125°C, making it suitable for automotive applications. This hybrid technology IC supports power supply circuits with matte tin terminal finish and zig-zag position.

Median Price

$40.340

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 73 parts In-Stock

1+ parts

$40.340

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$27.345

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73

$40.340

$27.345

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Mouser Electronics

USA . 42 parts In-Stock

1+ parts

$40.340

100+ parts

$31.820

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$31.260

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42

$40.340

$31.820

$31.260

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Distributors (In-Stock)

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Digiode

USA . 1,585 parts In-Stock

1+ parts

$37.563

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1,585

$37.563

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Vyrian

USA . 5,651 parts In-Stock

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5,651

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Distributors (Availability)

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Native Components

USA . 52 parts In-Stock

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$7.519

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52

$7.519

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Corphita

USA . 414 parts In-Stock

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$35.586

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414

$35.586

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Corohmni

South Africa . 303 parts In-Stock

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$39.540

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303

$39.540

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Component Stockers USA

USA . 408 parts In-Stock

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$358.820

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408

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Problanco Electronics

Mexico . 5,912 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,818 parts In-Stock

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Kulean Microsystems

USA . 5,614 parts In-Stock

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5,614

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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TANS Electronics

Latvia . 2,481 parts In-Stock

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Perfect Parts

USA . 1,257 parts In-Stock

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SupplyDigital Components

Austria . 556 parts In-Stock

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556

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Northwest PG Solutions

USA . 522 parts In-Stock

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$7.369

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522

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UHIMA Technologies

Türkiye . 237 parts In-Stock

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Overview

Elevate your automotive power management solutions with the FAM65HR51DS2 by Onsemi. This high-quality Power Management IC offers unparalleled reliability and performance, meeting AEC-Q100 screening levels for automotive applications. With a wide operating temperature range and sturdy flange mount package shape, this product is designed to excel in challenging environments. Trust Onsemi's expertise in power supply support circuits to deliver the efficiency and precision your projects demand. Experience the value and benefits of superior technology with the FAM65HR51DS2.

Feature Benefit Bullets

Screening Level AEC-Q100

This product has undergone rigorous automotive-grade testing, ensuring reliability in harsh environments.

Package Shape RECTANGULAR

Rectangular shape allows for easy integration into various PCB layouts, maximizing space efficiency.

No. of Terminals 16

Having 16 terminals provides flexibility in connecting to other components, enhancing functionality.

Package Style (Meter) FLANGE MOUNT

Flange mount package style allows for secure and stable mounting, reducing the risk of mechanical failures.

Maximum Operating Temperature 125 °C

With a high maximum operating temperature, this product can withstand extended periods of operation without overheating.

Minimum Operating Temperature -40 °C

A low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish Matte Tin (Sn) - annealed

Matte tin finish provides corrosion resistance and excellent solderability, increasing the product's lifespan.

Terminal Position ZIG-ZAG

Zig-zag terminal position simplifies PCB assembly and reduces the risk of short circuits.

Other IC type POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC ensures stable and efficient power delivery to the connected devices.

Temperature Grade AUTOMOTIVE

Designed for automotive applications, this product meets industry standards for temperature resistance and reliability.

Technology HYBRID

Hybrid technology combines the advantages of different technologies, offering high performance and efficiency.

Terminal Form THROUGH-HOLE

Through-hole terminal form simplifies the soldering process and provides mechanical strength to the connections.

Technical Specifications

Power Management ICs FAM65HR51DS2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-XZFM-T16

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Screening Level:

AEC-Q100

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Trade Compliance

FAM65HR51DS2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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