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FAM65HR51DS3

Onsemi

FAM65HR51DS3 by Onsemi

FAM65HR51DS3 by Onsemi is an AEC-Q100 compliant Power Management IC with 16 terminals in a flange mount package. Operating temperature range from -40 °C to 125°C, suitable for automotive applications. Features hybrid technology and zig-zag terminal position for power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,104 parts In-Stock

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Digiode

USA . 739 parts In-Stock

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739

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Native Components

USA . 432 parts In-Stock

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$51.244

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$49.194

432

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$49.194

Northwest PG Solutions

USA . 510 parts In-Stock

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$56.368

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510

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Kulean Microsystems

USA . 5,717 parts In-Stock

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TANS Electronics

Latvia . 5,055 parts In-Stock

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SupplyDigital Components

Austria . 4,546 parts In-Stock

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Problanco Electronics

Mexico . 1,813 parts In-Stock

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Corphita

USA . 612 parts In-Stock

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Corohmni

South Africa . 479 parts In-Stock

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UHIMA Technologies

Türkiye . 207 parts In-Stock

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Overview

Unleash the power of innovation with the FAM65HR51DS3 by Onsemi. Designed with precision and reliability in mind, this Power Management IC offers unrivaled performance and efficiency for a wide range of automotive applications. With Onsemi's commitment to quality, rest assured that you are getting a product that is built to last. Experience the seamless integration and enhanced functionality that this IC brings, providing you with the value and benefits you need to take your projects to the next level. Elevate your automotive designs with the FAM65HR51DS3 today.

Feature Benefit Bullets

Screening Level: AEC-Q100

This product is designed to meet the strict automotive quality standards, ensuring reliability and durability in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it ideal for compact designs.

No. of Terminals: 16

With 16 terminals, this product offers versatility in connecting to various components and peripherals in the circuit.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides a secure and stable mounting option, ensuring reliability in harsh environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to perform reliably in automotive applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function in cold environments, making it suitable for automotive applications in various climates.

Terminal Position: ZIG-ZAG

The zig-zag terminal position facilitates easy soldering and connection, enhancing the product's ease of use during assembly.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this product assists in stabilizing and regulating the power supply in automotive systems, improving overall performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive temperature grades, this product offers reliable operation in the demanding conditions of automotive environments.

Technology: HYBRID

The hybrid technology used in this product combines the benefits of different technologies, offering a balance of performance and efficiency in power management.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure connection to the PCB, ensuring stability and robustness in automotive applications.

Technical Specifications

Power Management ICs FAM65HR51DS3 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-XZFM-T16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Screening Level:

AEC-Q100

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Trade Compliance

FAM65HR51DS3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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