Loading...

FAM65HR51DS1

Onsemi

FAM65HR51DS1 by Onsemi

FAM65HR51DS1 by Onsemi is an AEC-Q100 compliant Power Management IC with 16 terminals in a rectangular flange mount package. It operates b/w -40 °C to 125°C, making it suitable for automotive applications. This hybrid technology IC supports power supply circuits with matte tin terminal finish and zig-zag position.

Median Price

$36.025

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 71 parts In-Stock

1+ parts

$34.030

100+ parts

$33.090

1k+ parts

$31.960

10k+ parts

-

71

$34.030

$33.090

$31.960

-

DigiKey

USA . 64 parts In-Stock

1+ parts

$38.020

100+ parts

$34.517

1k+ parts

$33.362

10k+ parts

-

64

$38.020

$34.517

$33.362

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 366 parts In-Stock

1+ parts

$35.692

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$35.692

-

-

-

Vyrian

USA . 2,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,547

-

-

-

-

Flip Electronics

USA . 2,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,304

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 757 parts In-Stock

1+ parts

$33.813

100+ parts

-

1k+ parts

-

10k+ parts

-

757

$33.813

-

-

-

Corohmni

South Africa . 122 parts In-Stock

1+ parts

$37.570

100+ parts

-

1k+ parts

-

10k+ parts

-

122

$37.570

-

-

-

Native Components

USA . 791 parts In-Stock

1+ parts

$60.229

100+ parts

-

1k+ parts

-

10k+ parts

$57.820

791

$60.229

-

-

$57.820

Northwest PG Solutions

USA . 2,295 parts In-Stock

1+ parts

$66.252

100+ parts

-

1k+ parts

-

10k+ parts

-

2,295

$66.252

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,728

-

-

-

-

TANS Electronics

Latvia . 8,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,103

-

-

-

-

Problanco Electronics

Mexico . 6,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,151

-

-

-

-

SupplyDigital Components

Austria . 3,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,718

-

-

-

-

Kulean Microsystems

USA . 983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

983

-

-

-

-

UHIMA Technologies

Türkiye . 283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

283

-

-

-

-

Overview

Enhance your automotive power management systems with the FAM65HR51DS1 by Onsemi. This top-of-the-line power management IC boasts AEC-Q100 screening level, ensuring reliable performance in the harshest conditions. With a temperature grade of AUTOMOTIVE and hybrid technology, this product offers unmatched quality and durability. Ideal for power supply support circuits, this rectangular flange mount IC provides seamless integration and optimal efficiency. Trust Onsemi to deliver cutting-edge solutions that exceed expectations. Upgrade your automotive applications with the FAM65HR51DS1 today!

Feature Benefit Bullets

Screening Level: AEC-Q100

This product has been through rigorous automotive-grade testing, ensuring reliability and performance in harsh automotive environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various automotive electronic systems.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options for power management functions in automotive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that this product can withstand extreme conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function reliably even in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: ZIG-ZAG

The zig-zag terminal position helps in efficient routing of connections and reduces the risk of short circuits.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This product is designed specifically to support power supply functions, making it ideal for power management applications in automotive systems.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent temperature requirements and environmental conditions of the automotive industry.

Technology: HYBRID

The hybrid technology used in this product combines the benefits of different technologies, resulting in optimized performance and efficiency.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical connections, making this product suitable for automotive applications where vibration and mechanical stress are common.

Technical Specifications

Power Management ICs FAM65HR51DS1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-XZFM-T16

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Screening Level:

AEC-Q100

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

ZIG-ZAG

Trade Compliance

FAM65HR51DS1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2