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CS8240YTQVA5

Onsemi

CS8240YTQVA5 by Onsemi

CS8240YTQVA5 by Onsemi is a Peripheral Driver with built-in protections for transient, over current, and over voltage. It operates at power supplies of 6-24V and has a max output current of 0.225A. This automotive-grade device in rectangular package shape is ideal for buffer or inverter based applications requiring source flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,368 parts In-Stock

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Digiode

USA . 649 parts In-Stock

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649

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Distributors (Availability)

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AZTECH Wire

Italy . 156 parts In-Stock

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$8.680

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156

$8.680

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TANS Electronics

Latvia . 5,850 parts In-Stock

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5,850

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Kulean Microsystems

USA . 1,607 parts In-Stock

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Corphita

USA . 1,589 parts In-Stock

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Problanco Electronics

Mexico . 1,306 parts In-Stock

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Northwest PG Solutions

USA . 801 parts In-Stock

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$4.495

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801

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$4.495

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UHIMA Technologies

Türkiye . 686 parts In-Stock

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686

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Native Components

USA . 248 parts In-Stock

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$4.449

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Corohmni

South Africa . 223 parts In-Stock

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223

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SupplyDigital Components

Austria . 213 parts In-Stock

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Microchip USA

USA . 124 parts In-Stock

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Overview

Enhance your automotive electronic systems with the CS8240YTQVA5 from Onsemi, a top-tier manufacturer known for delivering high-quality peripheral drivers. This versatile component offers built-in protections against transient events, over current, over voltage, and thermal issues, ensuring optimal performance and reliability. With a nominal supply voltage of 12V and a maximum output current of 0.225A, this product is perfect for a wide range of applications in the automotive industry. Experience the value and benefits of seamless operation and enhanced safety with this superior peripheral driver from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to impacts, making the product suitable for various industrial environments.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protections ensure the safety of the connected devices and prevent damage in case of any electrical faults or fluctuations.

Power Supplies (V): 6/24

Flexible power supply options allow compatibility with a wide range of devices and systems that require either 6V or 24V operation.

Maximum Operating Temperature: 125 °C

High operating temperature capability ensures reliable performance even in harsh conditions or environments where temperatures may rise significantly.

Nominal Output Peak Current Limit: 1.1 A

A high peak current limit allows the product to handle sudden spikes in current demand without overheating or malfunctioning.

Technical Specifications

Peripheral Drivers CS8240YTQVA5 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PZFM-T5

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.225 A

Nominal Output Peak Current Limit:

1.1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP5,.15,.17,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Power Supplies (V):

6/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

ZIG-ZAG

Turn-off Time:

20 us

Turn-on Time:

20 us

Trade Compliance

CS8240YTQVA5 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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