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CS-8240YT5

Onsemi

CS-8240YT5 by Onsemi

CS-8240YT5 by Onsemi is a Peripheral Driver with 5 terminals, operating at -40 to 125 °C. It has a max output current of 0.225A and supports power supplies of 6-24V. Ideal for automotive applications due to its technology and temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,116 parts In-Stock

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Vyrian

USA . 435 parts In-Stock

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435

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Problanco Electronics

Mexico . 6,865 parts In-Stock

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SupplyDigital Components

Austria . 6,670 parts In-Stock

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Kulean Microsystems

USA . 4,541 parts In-Stock

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Northwest PG Solutions

USA . 2,166 parts In-Stock

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TANS Electronics

Latvia . 1,768 parts In-Stock

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Corphita

USA . 852 parts In-Stock

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Native Components

USA . 509 parts In-Stock

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UHIMA Technologies

Türkiye . 290 parts In-Stock

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Corohmni

South Africa . 69 parts In-Stock

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Overview

Experience the unbeatable quality and reliability of Onsemi with the CS-8240YT5 Peripheral Driver. This powerhouse product offers unmatched performance in a variety of automotive applications, delivering power supplies from 6 to 24 volts with ease. With a temperature range of -40 to 125 °C and a maximum output current of 0.225A, this driver is perfect for demanding environments. Trust Onsemi for cutting-edge technology and superior products that excel where others fall short. Elevate your projects with the CS-8240YT5 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection, making the product long-lasting and reliable.

Power Supplies (V): 6/24

The wide range of power supplies (6V to 24V) ensures compatibility with various systems and applications, offering flexibility in use.

No. of Terminals: 5

Having 5 terminals allows for multiple connections and configurations, enabling versatile integration with other components.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand elevated temperatures, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance even in extremely cold environments, increasing the product's usability.

Terminal Finish: Tin/Lead (Sn/Pb)

The use of tin/lead terminal finish enhances conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures easy connection, making the product user-friendly.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is designed to meet the stringent requirements of automotive applications, ensuring reliability and safety.

Maximum Output Current: 0.225 A

With a maximum output current of 0.225 A, the product can deliver sufficient power to drive peripheral devices effectively, meeting the performance needs of various systems.

Technology: BIPOLAR

The bipolar technology used in the product ensures stable and precise operation, making it suitable for driving peripherals with high accuracy and efficiency.

Terminal Pitch: 1.7 mm

The narrow terminal pitch of 1.7 mm allows for compact design and efficient use of space, making the product suitable for tight installations and applications.

Technical Specifications

Peripheral Drivers CS-8240YT5 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-609 Code:

e0

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.225 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP5,.1,67TB

Power Supplies (V):

6/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

CS-8240YT5 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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