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CS5174GDR8

Onsemi

CS5174GDR8 by Onsemi

CS5174GDR8 by Onsemi is a switching regulator with 2.4A output current and 620kHz max switching frequency. It operates b/w 0-125 °C, suitable for boost applications in various electronic devices due to its small outline package and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,734 parts In-Stock

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Digiode

USA . 790 parts In-Stock

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Northwest PG Solutions

USA . 428 parts In-Stock

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$2.782

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AZTECH Wire

Italy . 822 parts In-Stock

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$21.820

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Problanco Electronics

Mexico . 6,642 parts In-Stock

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Kulean Microsystems

USA . 4,357 parts In-Stock

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SupplyDigital Components

Austria . 4,159 parts In-Stock

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Corphita

USA . 1,678 parts In-Stock

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UHIMA Technologies

Türkiye . 459 parts In-Stock

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Microchip USA

USA . 457 parts In-Stock

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Native Components

USA . 334 parts In-Stock

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$2.453

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Corohmni

South Africa . 241 parts In-Stock

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TANS Electronics

Latvia . 125 parts In-Stock

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Overview

Discover the CS5174GDR8 by Onsemi, a cutting-edge switching regulator & controller that offers unmatched quality and reliability. Manufactured by the reputable Onsemi, this product is designed to exceed expectations in various applications. With its small outline package style and dual terminal position, this regulator provides exceptional performance in a compact size. Experience the benefits of current-mode control, pulse width modulation, and boost switcher configuration for efficient power management. Trust Onsemi to deliver superior technology and innovation, making the CS5174GDR8 the ideal choice for your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability ensures easy and convenient integration into circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the circuit board, optimizing space usage.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the regulator to other components in the circuit.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control offers fast and accurate response to load changes, improving overall efficiency and stability.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish ensures good conductivity and solderability for reliable connections.

Maximum Output Current: 2.4 A

The high maximum output current allows the regulator to power a variety of components, making it versatile in different applications.

Technical Specifications

Switching Regulators & Controllers CS5174GDR8 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

620 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5174GDR8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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