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CS51414EDR8

Onsemi

CS51414EDR8 by Onsemi

CS51414EDR8 by Onsemi is a switching regulator with 3A output current, PWM control technique, and 594kHz max switching frequency. Ideal for industrial applications, it operates b/w -40 to 85°C and supports input voltages from 4.5V to 40V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,433 parts In-Stock

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1,433

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Vyrian

USA . 592 parts In-Stock

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592

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Benley Electronics

USA . 40 parts In-Stock

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$0.400

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40

$0.400

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AZTECH Wire

Italy . 243 parts In-Stock

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$9.408

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243

$9.408

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TANS Electronics

Latvia . 7,718 parts In-Stock

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Problanco Electronics

Mexico . 6,104 parts In-Stock

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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5,500

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SupplyDigital Components

Austria . 4,007 parts In-Stock

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4,007

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Continental Prestige Electronics

USA . 2,590 parts In-Stock

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2,590

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Argo Parts USA

USA . 926 parts In-Stock

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926

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Corphita

USA . 703 parts In-Stock

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Kulean Microsystems

USA . 489 parts In-Stock

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489

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Microchip USA

USA . 403 parts In-Stock

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Corohmni

South Africa . 369 parts In-Stock

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369

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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154

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Power up your devices with the CS51414EDR8 by Onsemi, a top-of-the-line switching regulator that promises unmatched quality and reliability. Manufactured by industry leader Onsemi, this cutting-edge product is designed to meet all your power management needs with ease. Perfect for a wide range of applications, this compact regulator offers customers incredible value with its efficient performance and advanced features. Say goodbye to power interruptions and hello to seamless operation with the CS51414EDR8 - the ultimate solution for all your power control requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for portable applications.

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package helps in efficient placement on the PCB.

No. of Terminals: 8

With 8 terminals, this product can handle multiple connections efficiently.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves PCB real estate and is ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand tough environmental conditions.

Control Mode: CURRENT/VOLTAGE-MODE

Dual control modes offer flexibility in adjusting the output as per the requirements.

Minimum Operating Temperature: -40 °C

The low operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish provides good solderability for easy assembly.

Terminal Position: DUAL

Dual terminal positioning provides redundancy and ensures a secure connection.

Maximum Seated Height: 1.75 mm

The low seated height makes this product suitable for compact designs with height restrictions.

Width (mm): 3.9 mm

The narrow width of the product allows for easy placement in tight spaces on the PCB.

Other IC type: SWITCHING REGULATOR

As a switching regulator, this product offers high efficiency and low power dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 235

The high peak reflow temperature can handle the soldering process effectively.

Length: 4.9 mm

The compact length of the product saves space on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions.

Maximum Switching Frequency: 594 kHz

High switching frequency allows for fast response and stable output.

Maximum Output Current: 3 A

With a high output current capacity, this product can power multiple components efficiently.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and easy solderability.

Control Technique: PULSE WIDTH MODULATION

The PWM control technique offers precise output voltage regulation.

Switcher Config: BUCK

Buck configuration allows for efficient step-down voltage conversion.

Terminal Pitch: 1.27 mm

The small terminal pitch enables close packing on the PCB for higher component density.

Minimum Input Voltage: 4.5 V

With a low minimum input voltage, this product is suitable for battery-powered applications.

Maximum Input Voltage: 40 V

The high maximum input voltage allows for a wide range of input sources to be used.

Technical Specifications

Switching Regulators & Controllers CS51414EDR8 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CURRENT

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

594 kHz

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS51414EDR8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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