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CS5171GDR8

Onsemi

CS5171GDR8 by Onsemi

CS5171GDR8 by Onsemi is a switching regulator with 2.4A output current and 310kHz max switching frequency. It operates b/w 0-125°C, ideal for boost applications with input voltage range of 2.7-30V. Package style is small outline, making it suitable for compact designs in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 2,425 parts In-Stock

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Digiode

USA . 2,361 parts In-Stock

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2,361

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Vyrian

USA . 158 parts In-Stock

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158

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Nova Conductors

Japan . 81 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 805 parts In-Stock

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$13.620

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805

$13.620

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Aztec Data Supply Inc.

USA . 508 parts In-Stock

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$21.058

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508

$21.058

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RC Electronics

USA . 20,000 parts In-Stock

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$1.320

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$1.250

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$1.220

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$1.320

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$1.220

Lixinc

USA . 16,882 parts In-Stock

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Continental Prestige Electronics

USA . 6,632 parts In-Stock

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TANS Electronics

Latvia . 6,176 parts In-Stock

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Kulean Microsystems

USA . 5,199 parts In-Stock

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S.R.D Solutions

India . 4,500 parts In-Stock

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Problanco Electronics

Mexico . 3,845 parts In-Stock

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Corphita

USA . 2,482 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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SupplyDigital Components

Austria . 1,310 parts In-Stock

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Kepictronics

USA . 880 parts In-Stock

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UHIMA Technologies

Türkiye . 877 parts In-Stock

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Corohmni

South Africa . 185 parts In-Stock

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Argo Parts USA

USA . 147 parts In-Stock

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Microchip USA

USA . 117 parts In-Stock

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Overview

Discover the power of the CS5171GDR8 by Onsemi, a top-of-the-line switching regulator and controller designed to optimize efficiency and performance. With a focus on quality and reliability, Onsemi has crafted a product that delivers consistent results in a compact package. From boosting voltage to controlling current, this versatile device is perfect for a wide range of applications. Say goodbye to inefficiency and hello to seamless operation with the CS5171GDR8. Experience the difference for yourself today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Ease of installation and space-saving design makes it suitable for compact electronic devices.

No. of Terminals: 8

Sufficient number of terminals for connecting various components in the circuit.

Maximum Operating Temperature: 125 °C

High operating temperature allows for stable performance even in demanding conditions.

Control Mode: CURRENT-MODE

Current-mode control provides efficient regulation and enhances overall performance.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in regulating output voltage.

Maximum Output Current: 2.4 A

High output current enables the product to power a variety of components or devices.

Minimum Input Voltage: 2.7 V

Low minimum input voltage allows for flexibility in power source options.

Technical Specifications

Switching Regulators & Controllers CS5171GDR8 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

310 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5171GDR8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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