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CS5173GD8

Onsemi

CS5173GD8 by Onsemi

CS5173GD8 by Onsemi is a switching regulator with 2.4A output current and 620kHz max frequency. Ideal for boost applications, it operates b/w 0-125 °C, with input voltage range of 2.7-30V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,726 parts In-Stock

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6,726

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Digiode

USA . 990 parts In-Stock

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990

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Distributors (Availability)

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Native Components

USA . 288 parts In-Stock

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$0.332

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$0.319

288

$0.332

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$0.319

Northwest PG Solutions

USA . 2,155 parts In-Stock

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$0.366

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$0.322

2,155

$0.366

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$0.322

AZTECH Wire

Italy . 841 parts In-Stock

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$14.290

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841

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Problanco Electronics

Mexico . 7,784 parts In-Stock

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7,784

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Kulean Microsystems

USA . 6,563 parts In-Stock

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SupplyDigital Components

Austria . 6,058 parts In-Stock

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6,058

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TANS Electronics

Latvia . 5,647 parts In-Stock

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UHIMA Technologies

Türkiye . 472 parts In-Stock

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472

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Corphita

USA . 361 parts In-Stock

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361

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Corohmni

South Africa . 226 parts In-Stock

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Microchip USA

USA . 130 parts In-Stock

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Overview

Discover the power of innovation with the CS5173GD8 by Onsemi. As a leading manufacturer in the field of Switching Regulators & Controllers, Onsemi delivers cutting-edge technology and unmatched quality in every product. The CS5173GD8 is designed to provide efficient power management solutions for a wide range of applications. With its compact design, current-mode control mode, and pulse width modulation technique, this switching regulator offers high performance and reliability. Trust Onsemi to bring you the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and light weight, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

Rectangular package shape enables easy placement on the PCB and efficient use of board space.

No. of Terminals: 8

The 8 terminals provide flexibility in connection options and enable the product to be used in a variety of circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style allows for compact design and space-saving on the PCB.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable operation in various environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control offers precise regulation and stability, making the product suitable for demanding applications.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature range ensures the product can function in both high and low temperature environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead finish on terminals provides good solderability and ensures strong electrical connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options and simplifies PCB layout.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact design and space-saving in the overall system.

Width (mm): 3.9 mm

Narrow width enables efficient placement on the PCB and saves space in the system design.

Other IC type: SWITCHING REGULATOR

Being a switching regulator, the product offers high efficiency and precise voltage regulation, making it suitable for various power supply applications.

Nominal Input Voltage: 3.3 V

The nominal input voltage of 3.3V makes the product compatible with standard power sources, increasing its versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 235

High peak reflow temperature allows for robust solder joints, ensuring the product's reliability in harsh operating conditions.

Length: 4.9 mm

Compact length enables space-saving on the PCB and in the overall system design.

Maximum Switching Frequency: 620 kHz

High switching frequency enables fast response times and efficient power regulation, making the product suitable for demanding applications.

Maximum Output Current: 2.4 A

High output current rating allows the product to power a wide range of loads, increasing its applicability.

Technology: BIPOLAR

Bipolar technology offers stability and precision in voltage regulation, enhancing the product's performance in various applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and reliable soldering during assembly, ensuring robust electrical connections.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise regulation and efficiency, making the product ideal for power conversion applications.

Switcher Config: BOOST

Boost configuration allows the product to step up voltage levels efficiently, making it suitable for applications requiring higher output voltages.

Terminal Pitch: 1.27 mm

Narrow terminal pitch enables compact design and efficient PCB layout, saving space and improving system integration.

Minimum Input Voltage: 2.7 V

Low minimum input voltage allows the product to operate with a wide range of power sources, increasing its versatility.

Maximum Input Voltage: 30 V

High maximum input voltage rating ensures compatibility with various power sources, making the product suitable for a range of applications.

Technical Specifications

Switching Regulators & Controllers CS5173GD8 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2.4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

620 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5173GD8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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