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CS51412GDR8G

Onsemi

CS51412GDR8G by Onsemi

CS51412GDR8G by Onsemi is a switching regulator with 3A output current, 296kHz max frequency, and PWM control. Ideal for applications requiring voltage regulation in commercial-grade environments. Package style: small outline, surface mountable, with 8 terminals in a rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,514 parts In-Stock

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Digiode

USA . 2,464 parts In-Stock

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AZTECH Wire

Italy . 964 parts In-Stock

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$16.810

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$16.810

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Component Stockers USA

USA . 405 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 18,840 parts In-Stock

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Metaverse IC Inc.

Canada . 15,000 parts In-Stock

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TANS Electronics

Latvia . 7,122 parts In-Stock

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Microchip USA

USA . 5,866 parts In-Stock

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Kulean Microsystems

USA . 4,404 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Kepictronics

USA . 3,470 parts In-Stock

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SupplyDigital Components

Austria . 2,334 parts In-Stock

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Northwest PG Solutions

USA . 1,929 parts In-Stock

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Problanco Electronics

Mexico . 1,392 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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GreenTree Electronics

Israel . 249 parts In-Stock

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Native Components

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Corohmni

South Africa . 117 parts In-Stock

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UHIMA Technologies

Türkiye . 8 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Onsemi with the CS51412GDR8G switching regulator/controller. This innovative product offers a wide range of applications, making it a versatile solution for various projects. With a focus on value and customer satisfaction, Onsemi ensures that this product provides numerous benefits and advantages to users. Trust in Onsemi for top-notch performance and efficiency in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the regulator.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Enables easy integration into existing designs and layouts.

No. of Terminals: 8

Provides ample connectivity options for various circuit configurations.

Maximum Operating Temperature: 70 °C

Ensures stable and reliable performance even under high temperature conditions.

Control Mode: CURRENT/VOLTAGE-MODE

Allows for flexible and precise control over the output voltage/current levels, enhancing efficiency.

Width (mm): 3.9 mm

Compact size makes it suitable for applications with limited space constraints.

Maximum Switching Frequency: 296 kHz

High switching frequency enables efficient power conversion with minimal losses.

Maximum Output Current: 3 A

Capable of delivering high output current for powering a variety of components.

Minimum Input Voltage: 4.5 V

Allows for operation with low input voltages, making it suitable for a wide range of applications.

Technical Specifications

Switching Regulators & Controllers CS51412GDR8G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

CURRENT

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

296 kHz

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS51412GDR8G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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