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CS5124XD8G

Onsemi

CS5124XD8G by Onsemi

CS5124XD8G by Onsemi is a switching controller with 1.5A output current, 440kHz max frequency, and BICMOS technology. Ideal for industrial applications requiring pulse width modulation control at temperatures ranging from -40 to 105 °C.

Median Price

$5.580

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 108 parts In-Stock

1+ parts

$5.580

100+ parts

$2.594

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-

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108

$5.580

$2.594

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Chip1Stop

Japan . 146 parts In-Stock

1+ parts

$14.100

100+ parts

$5.790

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146

$14.100

$5.790

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Flip Electronics (Authorized)

USA . 2,040 parts In-Stock

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2,040

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Verical

USA . 1,940 parts In-Stock

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$2.563

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1,940

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$2.563

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Distributors (In-Stock)

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Digiode

USA . 2,205 parts In-Stock

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$5.301

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$5.301

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Vyrian

USA . 5,983 parts In-Stock

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5,983

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Flip Electronics

USA . 2,040 parts In-Stock

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ABC Electronics Ltd.

UK . 6 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 800 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

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10k+ parts

$0.081

800

$0.084

-

-

$0.081

Northwest PG Solutions

USA . 699 parts In-Stock

1+ parts

$0.092

100+ parts

-

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$0.081

699

$0.092

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-

$0.081

Benley Electronics

USA . 18 parts In-Stock

1+ parts

$0.400

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18

$0.400

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Corohmni

South Africa . 453 parts In-Stock

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$2.563

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453

$2.563

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Corphita

USA . 352 parts In-Stock

1+ parts

$5.022

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352

$5.022

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Advanced Electronics

New Zealand . 44 parts In-Stock

1+ parts

$16.083

100+ parts

$14.636

1k+ parts

$13.188

10k+ parts

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44

$16.083

$14.636

$13.188

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Kepictronics

USA . 5,400 parts In-Stock

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SupplyDigital Components

Austria . 4,561 parts In-Stock

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Metaverse IC Inc.

Canada . 4,401 parts In-Stock

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TANS Electronics

Latvia . 4,264 parts In-Stock

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Kulean Microsystems

USA . 4,158 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,858 parts In-Stock

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3,858

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Problanco Electronics

Mexico . 2,427 parts In-Stock

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Perfect Parts

USA . 1,468 parts In-Stock

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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Authorized Procurement Solutions

USA . 146 parts In-Stock

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146

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GreenTree Electronics

Israel . 146 parts In-Stock

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146

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Overview

Experience superior performance and reliability with the CS5124XD8G by Onsemi, a cutting-edge switching regulator & controller designed for industrial applications. Onsemi's commitment to quality and innovation shines through in this compact, high-efficiency device, offering customers unmatched value and benefits. With a wide input voltage range, high output current capability, and advanced control techniques, this product delivers optimal power management solutions for your projects. Trust Onsemi and elevate your designs with the CS5124XD8G today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good physical protection for the internal components of the regulator, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and improving overall performance.

Nominal Input Voltage: 12 V

Suitable for a wide range of applications that require a stable 12V input voltage.

Maximum Output Current: 1.5 A

Capable of delivering a maximum output current of 1.5A, making it suitable for powering a variety of components or devices.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for precise and efficient regulation of output voltage, ensuring stable performance.

Technical Specifications

Switching Regulators & Controllers CS5124XD8G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

20 V

Minimum Input Voltage:

7.6 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

440 kHz

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

CS5124XD8G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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