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BSR57L

Onsemi

BSR57L by Onsemi

BSR57L by Onsemi is a N-CHANNEL FET with 40V DS breakdown voltage, ideal for switching applications. Featuring a single configuration in a small outline package, it has a max on resistance of 40 ohm. This junction field-effect transistor uses silicon material and operates in depletion mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,491 parts In-Stock

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Vyrian

USA . 2,235 parts In-Stock

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TANS Electronics

Latvia . 7,579 parts In-Stock

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SupplyDigital Components

Austria . 5,534 parts In-Stock

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Corphita

USA . 2,263 parts In-Stock

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Kulean Microsystems

USA . 1,701 parts In-Stock

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Problanco Electronics

Mexico . 1,552 parts In-Stock

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Northwest PG Solutions

USA . 864 parts In-Stock

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Native Components

USA . 478 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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UHIMA Technologies

Türkiye . 24 parts In-Stock

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Overview

Unlock the power of innovative technology with the BSR57L by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in small signal field effect transistors like the BSR57L. This N-channel transistor is perfect for switching applications, offering customers seamless performance and efficiency. With a minimum DS breakdown voltage of 40V and maximum drain-source on resistance of 40 ohms, this transistor provides exceptional value and benefits to users looking for high-quality components. Elevate your projects with the BSR57L and experience the advantages of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging makes the transistor lightweight and durable for easy handling and long-term use.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are commonly used in power electronics applications due to their high efficiency and fast switching speeds.

Configuration: SINGLE

The single configuration simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in on/off control circuits.

Surface Mount: YES

Surface mount technology allows for easier and more cost-effective PCB assembly.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this transistor can handle higher voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and soldering on the PCB.

Terminal Form: GULL WING

The gull wing terminals are ideal for surface mount applications, providing secure connections and easy soldering.

Operating Mode: DEPLETION MODE

Depletion mode transistors are ideal for applications requiring normally-on operation, providing more design flexibility.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and ensures proper circuit functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in saving space on the PCB, making it suitable for compact electronic devices.

Field Effect Transistor Technology: JUNCTION

Junction FET technology offers high input impedance and low output capacitance, making it suitable for high-frequency applications.

Transistor Element Material: SILICON

Silicon-based transistors offer good thermal stability and performance, making them reliable for various applications.

Maximum Drain-Source On Resistance: 40 ohm

With a low on-resistance of 40 ohms, this transistor provides efficient power handling and minimal power loss.

Terminal Position: DUAL

Dual terminal positioning allows for easier and more secure connections during assembly, ensuring reliable operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSR57L attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain-Source On Resistance:

40 ohm

Field Effect Transistor Technology:

JUNCTION

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSR57L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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