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BS170RLRMG

Onsemi

BS170RLRMG by Onsemi

BS170RLRMG by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage and 0.5A max drain current. Ideal for switching applications, it features a single configuration with built-in diode in a cylindrical package suitable for through-hole mounting.

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1k+

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Vyrian

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Digiode

USA . 1,815 parts In-Stock

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Native Components

USA . 712 parts In-Stock

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$1.052

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Northwest PG Solutions

USA . 682 parts In-Stock

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AZTECH Wire

Italy . 604 parts In-Stock

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Kulean Microsystems

USA . 8,033 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 5,659 parts In-Stock

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GreenTree Electronics

Israel . 1,929 parts In-Stock

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SupplyDigital Components

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Corphita

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UHIMA Technologies

Türkiye . 528 parts In-Stock

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Corohmni

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Overview

Looking for a reliable solution for your switching applications? Look no further than the BS170RLRMG by Onsemi. With its high-quality construction and N-CHANNEL configuration, this Small Signal Field Effect Transistor offers exceptional performance and reliability. Whether you need it for DIY projects or professional use, this transistor's built-in diode and enhancement mode operation make it versatile and easy to use. Trust Onsemi's expertise in semiconductor technology and choose the BS170RLRMG for your next project. Experience the value and benefits it brings to your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are typically more efficient and have lower ON resistance compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse polarity protection, improving the overall reliability of the circuit.

Transistor Application: SWITCHING

Ideal for applications that require fast switching speeds and low power consumption.

Minimum DS Breakdown Voltage: 60 V

Can withstand high voltage levels, making it suitable for a wide range of applications.

Package Shape: ROUND

Round package shape allows for easy mounting and efficient use of space on a circuit board.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong mechanical connection, suitable for applications where durability is important.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors have lower ON resistance and can be controlled more easily in switching applications.

Maximum Drain Current (Abs): 0.5 A

Can handle a maximum drain current of 0.5A, suitable for low power applications.

Maximum Power Dissipation (Abs): 0.35 W

With a maximum power dissipation of 0.35W, it can operate reliably without overheating.

Package Style (Meter): CYLINDRICAL

Cylindrical package style allows for efficient heat dissipation, maintaining the performance of the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide semiconductor technology provides high efficiency and reliability in switching applications.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability in various applications.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and solderability, ensuring a strong electrical connection.

Maximum Drain-Source On Resistance: 5 ohm

Low ON resistance of 5 ohms ensures efficient operation and minimal power loss in the circuit.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and installation on a circuit board.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering during assembly, enhancing overall reliability.

Technical Specifications

Small Signal Field Effect Transistors (FET) BS170RLRMG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.5 A

Maximum Drain Current (ID):

.5 A

Maximum Drain-Source On Resistance:

5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-226AA

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BS170RLRMG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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