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BR281W31A101V1G

Onsemi

BR281W31A101V1G by Onsemi

BR281W31A101V1G by Onsemi is a consumer IC with 31 terminals in a rectangular grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With a very thin profile and fine pitch, it supports supply voltages from 1.25V to 3.63V, making it ideal for compact electronic devices.

Median Price

$3.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 729 parts In-Stock

1+ parts

$3.350

100+ parts

$2.340

1k+ parts

$1.840

10k+ parts

$1.560

729

$3.350

$2.340

$1.840

$1.560

Flip Electronics (Authorized)

USA . 13,000 parts In-Stock

1+ parts

-

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13,000

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Distributors (In-Stock)

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Digiode

USA . 2,044 parts In-Stock

1+ parts

$3.182

100+ parts

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2,044

$3.182

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Flip Electronics

USA . 13,000 parts In-Stock

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13,000

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Vyrian

USA . 4,277 parts In-Stock

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4,277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 644 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

-

10k+ parts

$0.157

644

$0.163

-

-

$0.157

Northwest PG Solutions

USA . 2,265 parts In-Stock

1+ parts

$0.180

100+ parts

-

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$0.158

2,265

$0.180

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-

$0.158

Corphita

USA . 1,603 parts In-Stock

1+ parts

$3.015

100+ parts

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1,603

$3.015

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Corohmni

South Africa . 150 parts In-Stock

1+ parts

$3.350

100+ parts

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150

$3.350

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QUARKTWIN TECHNOLOGY LTD

USA . 29,792 parts In-Stock

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Perfect Parts

USA . 4,906 parts In-Stock

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TANS Electronics

Latvia . 4,695 parts In-Stock

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4,695

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SupplyDigital Components

Austria . 3,227 parts In-Stock

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Microchip USA

USA . 2,418 parts In-Stock

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Problanco Electronics

Mexico . 1,979 parts In-Stock

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1,979

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Kepictronics

USA . 1,900 parts In-Stock

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1,900

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UHIMA Technologies

Türkiye . 732 parts In-Stock

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732

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Kulean Microsystems

USA . 497 parts In-Stock

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497

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Overview

Experience the cutting-edge technology of the BR281W31A101V1G by Onsemi, a top-tier manufacturer known for delivering high-quality consumer ICs. This innovative product, part of the Other Function category, offers a wide range of applications and benefits. With a sleek design and advanced features, this IC provides customers with exceptional value, increased efficiency, and superior performance. Elevate your projects with the BR281W31A101V1G and stay ahead of the curve in today's fast-paced tech industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and heat resistance, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration into PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient packing of components on a PCB, maximizing space utilization.

Maximum Operating Temperature: 85 °C

High maximum operating temperature enables the product to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures the product can operate in extreme cold conditions as well.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB.

Minimum Supply Voltage (Vsup): 1.25 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Long reflow time at peak temperature allows for proper soldering and component bonding during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure and reliable solder joints for stable operation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating indicates reliability and suitability for rugged industrial applications.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates proper alignment during assembly.

Maximum Supply Voltage (Vsup): 3.63 V

Moderate maximum supply voltage allows for compatibility with common power sources and flexibility in system design.

Technical Specifications

Other Function Consumer ICs BR281W31A101V1G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B31

Length:

2.77 mm

No. of Functions:

1

No. of Terminals:

31

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.635 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.52 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.45 mm

Trade Compliance

BR281W31A101V1G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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