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BR261W26A101E1G

Onsemi

BR261W26A101E1G by Onsemi

CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 26; Package Code: VFBGA; Package Shape: RECTANGULAR;

Median Price

$3.975

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$3.180

1k+ parts

$2.850

10k+ parts

$2.680

2,500

-

$3.180

$2.850

$2.680

DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$4.190

1k+ parts

-

10k+ parts

-

2,500

-

$4.190

-

-

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$3.975

1k+ parts

$3.563

10k+ parts

-

2,500

-

$3.975

$3.563

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,143 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,143

$2.850

-

-

-

Digiode

USA . 187 parts In-Stock

1+ parts

$3.363

100+ parts

-

1k+ parts

-

10k+ parts

-

187

$3.363

-

-

-

DigiKey Marketplace

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 240 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

-

240

$2.850

-

-

-

Corphita

USA . 2,467 parts In-Stock

1+ parts

$3.186

100+ parts

-

1k+ parts

-

10k+ parts

-

2,467

$3.186

-

-

-

Native Components

USA . 464 parts In-Stock

1+ parts

$5.929

100+ parts

-

1k+ parts

-

10k+ parts

-

464

$5.929

-

-

-

Problanco Electronics

Mexico . 7,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,503

-

-

-

-

Kulean Microsystems

USA . 5,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,227

-

-

-

-

SupplyDigital Components

Austria . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,680

-

-

-

-

TANS Electronics

Latvia . 4,064 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,064

-

-

-

-

Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.850

10k+ parts

-

2,500

-

-

$2.850

-

Northwest PG Solutions

USA . 2,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.810

10k+ parts

-

2,060

-

-

$5.810

-

UHIMA Technologies

Türkiye . 833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

833

-

-

-

-

Technical Specifications

Other Function Consumer ICs BR261W26A101E1G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B26

Length:

2.388 mm

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.233 mm

Trade Compliance

BR261W26A101E1G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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