Loading...

BR262W26A103E1G

Onsemi

BR262W26A103E1G by Onsemi

BR262W26A103E1G by Onsemi is a consumer circuit IC with 26 terminals in a grid array package. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.65V to 3.63V. This IC is ideal for industrial applications requiring a very thin profile and fine pitch design.

Median Price

$2.240

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 217,269 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

217,269

-

$2.240

$2.010

$1.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,229 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

10k+ parts

-

2,229

$2.375

-

-

-

Vyrian

USA . 6,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,668

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 290 parts In-Stock

1+ parts

$0.153

100+ parts

-

1k+ parts

-

10k+ parts

$0.147

290

$0.153

-

-

$0.147

Northwest PG Solutions

USA . 1,483 parts In-Stock

1+ parts

$0.168

100+ parts

-

1k+ parts

-

10k+ parts

$0.148

1,483

$0.168

-

-

$0.148

Corphita

USA . 473 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

473

$2.250

-

-

-

Corohmni

South Africa . 392 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

392

$2.500

-

-

-

AZTECH Wire

Italy . 1,140 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$8.470

-

-

-

Perfect Parts

USA . 175,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

175,638

-

-

-

-

Kepictronics

USA . 46,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

46,000

-

-

-

-

RC Electronics

USA . 42,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,847

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,893

-

-

-

-

Metaverse IC Inc.

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Kulean Microsystems

USA . 5,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,882

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,573

-

-

-

-

Alle Elektronik GmbH

Germany . 3,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,715

-

-

-

-

SupplyDigital Components

Austria . 1,739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,739

-

-

-

-

Microchip USA

USA . 1,298 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,298

-

-

-

-

Problanco Electronics

Mexico . 1,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

-

-

-

-

Futuretech Components

Singapore . 943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

943

-

-

-

-

UHIMA Technologies

Türkiye . 191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

191

-

-

-

-

TANS Electronics

Latvia . 117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

117

-

-

-

-

Overview

Elevate your consumer electronic designs with the BR262W26A103E1G by Onsemi. Crafted with precision and expertise, this versatile IC promises high-quality performance and reliability. From smart home devices to wearable technology, this product caters to a wide range of applications, delivering exceptional value and efficiency to customers. Trust in Onsemi's reputation for excellence and innovation, and unlock the endless possibilities with the BR262W26A103E1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to design and integrate this product into electronic devices with traditional PCB layouts.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-term reliability.

Width: 2.233 mm

The compact width of the product allows for high-density packaging on circuit boards, saving valuable space in electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes during assembly, ensuring strong and reliable connections.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certifies the product for use in demanding industrial applications that require high reliability and performance.

Terminal Pitch: 0.504 mm

The fine terminal pitch enables high-density mounting on PCBs, allowing for more functionality in a limited space.

Maximum Supply Voltage (Vsup): 3.63 V

The high maximum supply voltage tolerance provides flexibility in power source selection, accommodating a wide range of voltage levels.

Technical Specifications

Other Function Consumer ICs BR262W26A103E1G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B26

JESD-609 Code:

e1

Length:

2.388 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.504 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.233 mm

Trade Compliance

BR262W26A103E1G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3