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BBL4001-1E

Onsemi

BBL4001-1E by Onsemi

BBL4001-1E by Onsemi is a N-channel Power FET with 60V DS breakdown voltage and 296A IDM. Ideal for applications requiring high power dissipation up to 35W, such as power management systems. Features include single configuration, rectangular package shape, and enhanced mode operation.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,220 parts In-Stock

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Chip Stock

USA . 1,075 parts In-Stock

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Digiode

USA . 985 parts In-Stock

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985

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.240

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$1.128

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$1.017

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350

$1.240

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$1.017

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Corohmni

South Africa . 52 parts In-Stock

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$1.662

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AZTECH Wire

Italy . 993 parts In-Stock

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$16.720

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993

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Problanco Electronics

Mexico . 7,552 parts In-Stock

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CPlus Electronics

USA . 7,500 parts In-Stock

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SupplyDigital Components

Austria . 5,773 parts In-Stock

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TANS Electronics

Latvia . 4,111 parts In-Stock

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Kulean Microsystems

USA . 3,075 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,800 parts In-Stock

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Northwest PG Solutions

USA . 1,481 parts In-Stock

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Corphita

USA . 1,397 parts In-Stock

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Native Components

USA . 812 parts In-Stock

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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Overview

Unleash the power of innovation with the BBL4001-1E by Onsemi! This top-of-the-line Power Field Effect Transistor (FET) offers unmatched quality and reliability, thanks to its cutting-edge technology and superior manufacturing standards. Ideal for a wide range of applications, this N-CHANNEL FET provides high performance and efficiency, making it the perfect choice for all your power management needs. Experience the value and benefits of this exceptional product, designed to deliver outstanding results and ensure customer satisfaction every time. Elevate your projects with the BBL4001-1E and discover a whole new level of excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, making it suitable for various applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures the FET can handle high voltages without malfunctioning, making it reliable for use in power applications.

Maximum Pulsed Drain Current (IDM): 296 A

With a high pulsed drain current rating, this FET can handle sudden surges of current, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 35 W

The high power dissipation rating allows the FET to handle high levels of power without overheating, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can be used in various environments without the risk of overheating, increasing its versatility.

Technical Specifications

Power Field Effect Transistors (FET) BBL4001-1E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

370 mJ

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

74 A

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0098 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

540 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

296 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

BBL4001-1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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