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B300W35A109A1G

Onsemi

B300W35A109A1G by Onsemi

B300W35A109A1G by Onsemi is a consumer IC with 35 terminals in a grid array package. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.8V to 2V. This IC is ideal for industrial applications requiring a very thin profile and fine pitch design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,648 parts In-Stock

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1,648

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Vyrian

USA . 1,031 parts In-Stock

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1,031

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Distributors (Availability)

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Native Components

USA . 628 parts In-Stock

1+ parts

$40.125

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$38.520

628

$40.125

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$38.520

Northwest PG Solutions

USA . 466 parts In-Stock

1+ parts

$44.138

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466

$44.138

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Kulean Microsystems

USA . 6,205 parts In-Stock

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6,205

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TANS Electronics

Latvia . 5,039 parts In-Stock

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5,039

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SupplyDigital Components

Austria . 3,532 parts In-Stock

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3,532

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Problanco Electronics

Mexico . 3,299 parts In-Stock

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3,299

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Corphita

USA . 969 parts In-Stock

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Corohmni

South Africa . 379 parts In-Stock

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379

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UHIMA Technologies

Türkiye . 213 parts In-Stock

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213

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Overview

Discover the B300W35A109A1G by Onsemi, a high-quality consumer IC designed to elevate your electronics projects. With its advanced manufacturing techniques and top-notch materials, Onsemi ensures superior performance and reliability. Perfect for a wide range of applications, this versatile IC offers unmatched value with its compact size, low power consumption, and seamless integration. Unlock endless possibilities with the B300W35A109A1G and experience the innovation and convenience it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer electronics applications.

Surface Mount: YES

Surface mount capability allows for easy assembly onto circuit boards, saving time and labor costs in manufacturing.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of space on the circuit board, maximizing functionality in a compact design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation even in extreme cold conditions, ensuring consistent performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies connection to other components and enables efficient heat dissipation for better overall performance.

Width: 2.68 mm

Narrow width facilitates tight spacing on the circuit board, enabling higher component density and enhanced functionality in limited space.

Minimum Supply Voltage (Vsup): 1.8 V

Low minimum supply voltage requirement reduces power consumption, making the product energy-efficient and cost-effective in long-term use.

Length: 3.63 mm

Compact length allows for versatile placement options in a variety of electronic devices, optimizing design flexibility and customization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh conditions, making the product suitable for rugged applications.

Terminal Form: BALL

Ball terminal form provides secure electrical connections and improved heat dissipation, enhancing overall performance and longevity of the product.

Maximum Supply Voltage (Vsup): 2 V

High maximum supply voltage capability allows for flexibility in power source options and ensures compatibility with a wide range of electronic systems.

Technical Specifications

Other Function Consumer ICs B300W35A109A1G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B35

Length:

3.63 mm

No. of Functions:

1

No. of Terminals:

35

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.68 mm

Trade Compliance

B300W35A109A1G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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