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B300W35A109XXG

Onsemi

B300W35A109XXG by Onsemi

B300W35A109XXG by Onsemi is a consumer circuit IC with 35 terminals in a grid array package. It operates b/w -40 to 125 °C, suitable for automotive applications. With a very thin profile and fine pitch, it supports supply voltages from 0.9V to 2V, making it ideal for compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,694 parts In-Stock

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3,694

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Digiode

USA . 331 parts In-Stock

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331

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AZTECH Wire

Italy . 1,050 parts In-Stock

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$21.590

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1,050

$21.590

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Perfect Parts

USA . 389,133 parts In-Stock

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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90,000

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GreenTree Electronics

Israel . 49,255 parts In-Stock

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Kulean Microsystems

USA . 8,397 parts In-Stock

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SupplyDigital Components

Austria . 2,730 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,796 parts In-Stock

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Microchip USA

USA . 1,410 parts In-Stock

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Corphita

USA . 1,231 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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TANS Electronics

Latvia . 962 parts In-Stock

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Problanco Electronics

Mexico . 488 parts In-Stock

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UHIMA Technologies

Türkiye . 465 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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Native Components

USA . 231 parts In-Stock

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Overview

Discover the B300W35A109XXG by Onsemi, a top-quality consumer circuit that offers unmatched performance and reliability. Manufactured by Onsemi, a renowned leader in the industry, this product is ideal for a wide range of applications. With a very thin profile and fine pitch package style, this IC provides exceptional value and benefits to customers. Whether you're looking for automotive-grade components or high-performing electronics, the B300W35A109XXG is the perfect choice for your next project. Experience the advantages of Onsemi's innovative technology with this versatile and efficient consumer IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto a circuit board.

Package Shape: RECTANGULAR

The rectangular shape provides a uniform and compact form factor for the IC, making it easy to integrate into various electronic devices.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for performance, cost, and energy efficiency in consumer electronics.

No. of Terminals: 35

With a high number of terminals, this IC can support a wide range of functions and connectivity options.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch allows for high-density mounting and reliable connection in compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures that this IC can function effectively in both hot and cold environments.

Terminal Finish: TIN SILVER COPPER

The tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for reliable electrical connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies the assembly process and allows for efficient heat dissipation.

Maximum Seated Height: 1 mm

The low seated height of 1mm makes this IC suitable for slim and compact electronic devices.

Width: 2.68 mm

The narrow width of 2.68mm enables tight spacing and compact design layouts in electronic circuits.

Minimum Supply Voltage (Vsup): 0.9 V

The low minimum supply voltage of 0.9V allows for efficient power usage and extended battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time of 30 seconds ensures proper soldering of the IC during assembly for reliable performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this IC can withstand high-temperature soldering processes without damage.

Length: 3.63 mm

The compact length of 3.63mm allows for space-saving integration of this IC in miniature electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the high-performance and reliability standards required in automotive electronics.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections in the IC for enhanced electrical performance.

Maximum Supply Voltage (Vsup): 2 V

The maximum supply voltage of 2V ensures compatibility with various power sources and operating conditions.

Technical Specifications

Other Function Consumer ICs B300W35A109XXG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B35

JESD-609 Code:

e1

Length:

3.63 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

35

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.68 mm

Trade Compliance

B300W35A109XXG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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