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B300D44A103XXG

Onsemi

B300D44A103XXG by Onsemi

B300D44A103XXG by Onsemi is a 44-terminal consumer IC with AEC-Q100 screening for automotive applications. It operates b/w -40 to 125 °C, with a supply voltage range of 0.9V to 2V. This surface-mount IC has a small outline package style and is designed for consumer circuit use in automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 255 parts In-Stock

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Vyrian

USA . 131 parts In-Stock

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SupplyDigital Components

Austria . 5,298 parts In-Stock

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TANS Electronics

Latvia . 4,238 parts In-Stock

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Problanco Electronics

Mexico . 3,524 parts In-Stock

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Northwest PG Solutions

USA . 2,055 parts In-Stock

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Kulean Microsystems

USA . 1,587 parts In-Stock

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Corphita

USA . 1,202 parts In-Stock

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Native Components

USA . 836 parts In-Stock

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Corohmni

South Africa . 478 parts In-Stock

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UHIMA Technologies

Türkiye . 48 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the B300D44A103XXG by Onsemi, a leading manufacturer in the industry. This versatile consumer IC offers a wide range of applications, promising value and benefits to customers like never before. With its advanced features and innovative design, this product is a game-changer in the automotive sector. Trust Onsemi for cutting-edge technology that delivers exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient mounting on PCBs, making assembly processes quicker and more streamlined.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications where durability is crucial.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and fits well in most circuit designs, offering compatibility and ease of integration.

General IC Type: CONSUMER CIRCUIT

Designed for consumer electronics, this IC type caters to a wide range of applications in the consumer market, making it versatile and in-demand.

No. of Terminals: 44

Having a higher number of terminals allows for more connectivity options and functionality in the circuit design, offering flexibility and customization.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slub, and very thin profile package style provides efficient heat dissipation, space-saving design, and compatibility with compact electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and stability even in harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without compromising performance, making it suitable for automotive and industrial settings.

Terminal Position: DUAL

Dual terminal positions enhance connectivity options and offer redundancy, ensuring reliable performance and reducing the risk of connection failures.

Maximum Seated Height: 0.9 mm

With a low maximum seated height, this product offers a compact design and allows for flexible integration in space-constrained applications.

Width: 5 mm

The narrow width of 5 mm enables a slim and sleek design, making it suitable for compact electronic devices and applications where space is limited.

Minimum Supply Voltage (Vsup): 0.9 V

The low minimum supply voltage requirement of 0.9 V allows for energy-efficient operation and compatibility with low-power applications, making it cost-effective.

Length: 8.9 mm

The moderate length of 8.9 mm offers a balance between compactness and functionality, making it suitable for a wide range of electronic devices and applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability and performance in extreme temperature conditions, making it ideal for automotive electronics and industrial applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination, offering environmental friendliness and compliance with RoHS regulations.

Terminal Pitch: 0.4 mm

The narrow terminal pitch of 0.4 mm allows for high-density mounting and compact design, offering increased functionality and space savings in electronic devices.

Maximum Supply Voltage (Vsup): 2 V

The maximum supply voltage of 2 V provides flexibility and compatibility with a wide range of power sources, making it versatile and suitable for various applications.

Technical Specifications

Other Function Consumer ICs B300D44A103XXG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-N44

Length:

8.9 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

B300D44A103XXG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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