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B300W35A102XXG

Onsemi

B300W35A102XXG by Onsemi

B300W35A102XXG by Onsemi is a consumer IC with 35 terminals, operating from -40 to 85 °C. It features a power supply of 1.8V and comes in a grid array package suitable for industrial applications. This surface-mount IC is designed for consumer circuits requiring precise temperature control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,097 parts In-Stock

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Vyrian

USA . 466 parts In-Stock

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466

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Problanco Electronics

Mexico . 6,579 parts In-Stock

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Kulean Microsystems

USA . 6,270 parts In-Stock

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SupplyDigital Components

Austria . 3,458 parts In-Stock

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Northwest PG Solutions

USA . 2,122 parts In-Stock

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TANS Electronics

Latvia . 1,668 parts In-Stock

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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892

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Corphita

USA . 422 parts In-Stock

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Native Components

USA . 419 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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Overview

Discover the cutting-edge technology and superior quality of the B300W35A102XXG by Onsemi, a leading manufacturer in the industry. This innovative consumer IC offers a wide range of applications, delivering top-notch performance and reliability. With a package body material of PLASTIC/EPOXY and a rectangular shape, this product is designed for maximum efficiency. Trust Onsemi to provide you with the best solutions for your electronic needs, ensuring seamless integration and exceptional results. Upgrade your projects with the B300W35A102XXG and experience the unparalleled value and benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easy integration into electronic devices.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V can help reduce power consumption and extend battery life in portable electronic devices.

No. of Terminals: 35

Having a higher number of terminals allows for more input/output connections and functionality in the circuit design.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high-density mounting of components, resulting in compact and efficient circuit layouts.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows for operation in extreme cold environments without performance degradation.

Terminal Position: BOTTOM

Bottom terminal position provides ease of access for soldering and connecting to other components in the circuit.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh temperature conditions commonly found in industrial applications.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and is suitable for high-density mounting applications.

Terminal Pitch: 0.254 mm

Fine terminal pitch of 0.254mm allows for precise placement of terminals on the circuit board, enabling high-speed signal transmission and reduced signal loss.

Technical Specifications

Other Function Consumer ICs B300W35A102XXG attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B35

No. of Terminals:

35

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA35,5X14,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.254 mm

Terminal Position:

BOTTOM

Trade Compliance

B300W35A102XXG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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