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AX8052F100-3-TA05

Onsemi

AX8052F100-3-TA05 by Onsemi

AX8052F100-3-TA05 by Onsemi is a MICROCONTROLLER with 6-Ch 10-Bit ADC, 24 I/O lines, and 20 MHz clock frequency. Ideal for INDUSTRIAL applications requiring SPI and UART connectivity, it operates b/w -40 to 85 °C with ROM of 65536 words.

Median Price

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2

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1k+

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Vyrian

USA . 7,881 parts In-Stock

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Digiode

USA . 422 parts In-Stock

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AZTECH Wire

Italy . 1,199 parts In-Stock

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$8.500

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Native Components

USA . 765 parts In-Stock

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$9.652

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Northwest PG Solutions

USA . 769 parts In-Stock

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$10.618

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$9.556

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Kulean Microsystems

USA . 5,966 parts In-Stock

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TANS Electronics

Latvia . 4,373 parts In-Stock

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Microchip USA

USA . 2,937 parts In-Stock

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Problanco Electronics

Mexico . 2,806 parts In-Stock

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SupplyDigital Components

Austria . 2,430 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 778 parts In-Stock

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Corohmni

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Overview

Experience next-level performance and reliability with the AX8052F100-3-TA05 microcontroller from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. This microcontroller is perfect for a wide range of applications, offering advanced features like ADC channels, PWM channels, and connectivity options like SPI and UART. With a maximum clock frequency of 20 MHz and industrial-grade temperature tolerance, this microcontroller provides unmatched value and benefits to customers looking for high-performance solutions. Elevate your projects with the AX8052F100-3-TA05 microcontroller today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Ability to operate at higher voltages increases flexibility in power supply options for the device.

Package Shape: SQUARE

Square package shape provides uniformity and ease of mounting on the PCB.

No. of Terminals: 28

Sufficient number of terminals for connecting various external components and peripherals.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

ADC Channels: YES

Presence of Analog to Digital Converters enables the microcontroller to interface with analog sensors or signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU overhead.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data or code.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with multiple integrated peripherals, it is suitable for diverse embedded applications.

RAM Bytes: 8448

Adequate RAM capacity for data storage and manipulation during program execution.

Analog To Digital Convertors: 6-Ch 10-Bit

Multiple ADC channels with 10-bit resolution enable precise analog signal capture and processing.

PWM Channels: YES

Pulse Width Modulation channels for accurate control of analog outputs such as motor speed or LED brightness.

Connectivity: SPI, UART(2)

Support for Serial Peripheral Interface and dual UART connectivity for communication with other devices or peripherals.

ROM Programmability: FLASH

Flash ROM technology allows for easy programmability and reprogramming of the microcontroller's memory.

No. of I/O Lines: 24

Sufficient number of Input/Output lines for interfacing with external devices or components.

Technical Specifications

Microcontrollers AX8052F100-3-TA05 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8448

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(2), POR, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

AX8052F100-3-TA05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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