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AX8052F100-2-TW30

Onsemi

AX8052F100-2-TW30 by Onsemi

AX8052F100-2-TW30 by Onsemi is a Microcontroller with 3.6V max supply voltage, 20MHz clock frequency, and 65536 ROM words. Ideal for industrial applications, it features 6-Ch 10-Bit ADCs, SPI and UART connectivity, and FLASH ROM programmability.

Median Price

$1.586

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31,456 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.290

10k+ parts

$1.150

31,456

-

$1.560

$1.290

$1.150

Verical

USA . 26,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.613

10k+ parts

$1.438

26,000

-

-

$1.613

$1.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,429 parts In-Stock

1+ parts

$1.216

100+ parts

-

1k+ parts

-

10k+ parts

-

2,429

$1.216

-

-

-

Vyrian

USA . 2,767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,767

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 299 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$1.100

-

-

-

Corphita

USA . 1,843 parts In-Stock

1+ parts

$1.152

100+ parts

-

1k+ parts

-

10k+ parts

-

1,843

$1.152

-

-

-

Native Components

USA . 143 parts In-Stock

1+ parts

$11.374

100+ parts

-

1k+ parts

-

10k+ parts

-

143

$11.374

-

-

-

Northwest PG Solutions

USA . 886 parts In-Stock

1+ parts

$12.511

100+ parts

$11.260

1k+ parts

-

10k+ parts

-

886

$12.511

$11.260

-

-

AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$21.680

100+ parts

-

1k+ parts

-

10k+ parts

-

670

$21.680

-

-

-

Continental Prestige Electronics

USA . 31,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.210

10k+ parts

-

31,456

-

-

$1.210

-

Problanco Electronics

Mexico . 4,790 parts In-Stock

1+ parts

-

100+ parts

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4,790

-

-

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Kulean Microsystems

USA . 1,287 parts In-Stock

1+ parts

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100+ parts

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1,287

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TANS Electronics

Latvia . 679 parts In-Stock

1+ parts

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679

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Microchip USA

USA . 355 parts In-Stock

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355

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SupplyDigital Components

Austria . 255 parts In-Stock

1+ parts

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100+ parts

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255

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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126

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Overview

Unlock the potential of your electronic designs with the AX8052F100-2-TW30 by Onsemi. This cutting-edge microcontroller offers unmatched quality and reliability, thanks to Onsemi's reputation for producing top-tier components. Ideal for a wide range of applications in the industrial sector, this microcontroller boasts advanced features like ADC channels, DMA channels, and PWM channels. With a compact package style and impressive clock frequency, the AX8052F100-2-TW30 delivers exceptional value and performance to customers looking to elevate their projects to new heights. Experience the difference with Onsemi's innovative technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this microcontroller a convenient choice for manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the microcontroller within a wide range of applications.

Package Shape: SQUARE

The square package shape optimizes space utilization on the PCB, making it a compact and efficient choice for design layouts.

No. of Terminals: 28

With 28 terminals, this microcontroller offers sufficient connectivity options for interfacing with external components in a variety of circuits.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for energy efficiency and compatibility with lower voltage systems, making it versatile for a range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand demanding environmental conditions, enhancing its reliability in various settings.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature enables this microcontroller to function in extreme cold environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures reliable connections and prevents corrosion, prolonging the lifespan of the microcontroller.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion within the microcontroller, simplifying the process of interfacing with analog sensors and signals.

DMA Channels: YES

DMA channels support direct memory access, improving data transfer speeds and freeing up the CPU for other tasks, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position provides a stable and secure mounting arrangement, ensuring durability and ease of integration into the circuit layout.

ROM Words: 65536

The large ROM capacity allows for storing a significant amount of program code, enabling complex algorithms and functionalities to be implemented.

Maximum Seated Height: 1 mm

The low seated height facilitates a slim and compact design profile, ideal for applications with space constraints or where thin form factors are desired.

Width: 5 mm

The narrow width of the microcontroller makes it suitable for applications requiring a small footprint on the PCB, allowing for efficient use of space.

Peripherals: BOD, COMPARATOR(2), DMA(2), POR, TIMER(4), WDT

A variety of integrated peripherals enhance the functionality of the microcontroller, offering features such as brown-out detection, timers, and watchdog timers for enhanced system reliability and performance.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency enables fast processing and response times, making this microcontroller suitable for applications requiring real-time operation or high-speed data processing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the microcontroller can withstand the rigors of the reflow soldering process during PCB assembly, ensuring robust solder joints and reliable connections.

Length: 5 mm

The short length of the microcontroller contributes to its compact form factor, making it a space-efficient choice for applications with limited board space.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller offers reliable performance across a wide temperature range, making it suitable for harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller IC, this product offers specialized processing capabilities and features tailored for embedded system applications, ensuring efficient and reliable operation.

RAM Bytes: 8448

The ample RAM capacity allows for efficient data storage and manipulation within the microcontroller, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this microcontroller energy-efficient and reliable for various electronic devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process by eliminating the need for leaded components, promoting environmental sustainability and compliance with lead-free regulations.

Analog To Digital Convertors: 6-Ch 10-Bit

The presence of six analog-to-digital converters with 10-bit resolution enables precise and accurate measurement of analog signals, expanding the range of sensor interfaces and control options.

PWM Channels: YES

PWM channels support pulse-width modulation output, enabling precise control of motor speed, LED brightness, and other applications requiring variable output levels.

Connectivity: SPI, UART(2)

Integrated SPI and dual UART interfaces provide flexible and efficient communication options for connecting to external devices, peripherals, and networks, enhancing the microcontroller's versatility and compatibility.

ROM Programmability: FLASH

Flash programmability allows for easy and convenient updating of firmware and software, enabling quick modifications and enhancements to the microcontroller's functionality without requiring specialized equipment.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and compact PCB layouts, ideal for space-constrained designs and miniaturized electronic devices.

On Chip Program ROM Width: 8

The 8-bit width of the on-chip program ROM enhances the microcontroller's processing efficiency and data handling capabilities, supporting a wide range of algorithmic operations and calculations.

No. of I/O Lines: 24

With 24 input/output lines, this microcontroller provides ample connectivity for interfacing with external devices, sensors, and control elements, offering flexibility and versatility in system design and integration.

Technical Specifications

Microcontrollers AX8052F100-2-TW30 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8448

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(2), POR, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

AX8052F100-2-TW30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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