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AX8052F100-3-TW30

Onsemi

AX8052F100-3-TW30 by Onsemi

AX8052F100-3-TW30 by Onsemi is a microcontroller with 28 terminals, 20 MHz clock frequency, and 6-Ch 10-Bit ADC channels. Ideal for industrial applications requiring SPI and UART connectivity, featuring FLASH ROM programmability and 8448 bytes of RAM.

Median Price

$6.820

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,171 parts In-Stock

1+ parts

-

100+ parts

$6.320

1k+ parts

$5.650

10k+ parts

$5.320

9,171

-

$6.320

$5.650

$5.320

Verical

USA . 9,171 parts In-Stock

1+ parts

-

100+ parts

$7.900

1k+ parts

$7.063

10k+ parts

-

9,171

-

$7.900

$7.063

-

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$7.320

1k+ parts

$7.320

10k+ parts

$7.320

9,000

-

$7.320

$7.320

$7.320

Farnell

UK . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$5.550

9,000

-

-

-

$5.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,246 parts In-Stock

1+ parts

$5.550

100+ parts

-

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2,246

$5.550

-

-

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Digiode

USA . 1,138 parts In-Stock

1+ parts

$6.688

100+ parts

-

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1,138

$6.688

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 402 parts In-Stock

1+ parts

$5.550

100+ parts

-

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-

10k+ parts

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402

$5.550

-

-

-

Corphita

USA . 1,459 parts In-Stock

1+ parts

$6.336

100+ parts

-

1k+ parts

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-

1,459

$6.336

-

-

-

Native Components

USA . 926 parts In-Stock

1+ parts

$29.390

100+ parts

-

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10k+ parts

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926

$29.390

-

-

-

Northwest PG Solutions

USA . 2,094 parts In-Stock

1+ parts

$32.329

100+ parts

$29.096

1k+ parts

-

10k+ parts

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2,094

$32.329

$29.096

-

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Perfect Parts

USA . 20,048 parts In-Stock

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20,048

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Continental Prestige Electronics

USA . 9,000 parts In-Stock

1+ parts

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100+ parts

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$5.550

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9,000

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-

$5.550

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Problanco Electronics

Mexico . 8,224 parts In-Stock

1+ parts

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8,224

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SupplyDigital Components

Austria . 6,941 parts In-Stock

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6,941

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Authorized Procurement Solutions

USA . 2,900 parts In-Stock

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2,900

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TANS Electronics

Latvia . 1,046 parts In-Stock

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1,046

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UHIMA Technologies

Türkiye . 975 parts In-Stock

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975

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Microchip USA

USA . 112 parts In-Stock

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112

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Kulean Microsystems

USA . 89 parts In-Stock

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89

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Overview

Unlock the potential of your electronic designs with the AX8052F100-3-TW30 microcontroller by Onsemi. Known for their high-quality manufacturing and cutting-edge technology, Onsemi delivers superior performance and reliability. This versatile microcontroller offers a wide range of applications in various industries, providing value and benefits to customers seeking efficient solutions. With features like multiple ADC channels, DMA channels, and PWM channels, this microcontroller is perfect for projects requiring precision and speed. Experience the advantages of Onsemi's AX8052F100-3-TW30 and take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier for the product to be assembled on a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, giving flexibility in designing power supply circuits.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables operation in low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance allows the product to operate reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range support ensures functionality in extreme cold environments.

ADC Channels: YES

Integrated analog-to-digital converters enable the product to interface with external sensors and convert analog signals to digital data.

DMA Channels: YES

Direct Memory Access channels provide efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 65536

Large Read-Only Memory capacity allows for storing a significant amount of program data and instruction sets.

RAM Bytes: 8448

Generous Random Access Memory capacity enables storing and processing of temporary data during program execution.

Maximum Clock Frequency: 20 MHz

High clock frequency supports fast processing speed, enhancing the product's overall performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various essential peripherals and components on a single chip, simplifying system design.

Connectivity: SPI, UART(2)

Multiple connectivity options such as SPI and UART interfaces allow for easy communication with other devices and expand the product's capabilities.

ROM Programmability: FLASH

Flash memory enables easy reprogrammability of the device, allowing for software updates and customization.

Technical Specifications

Microcontrollers AX8052F100-3-TW30 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8448

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20.2 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(2), POR, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

AX8052F100-3-TW30 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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