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AX8052F100-2-TA05

Onsemi

AX8052F100-2-TA05 by Onsemi

AX8052F100-2-TA05 by Onsemi is a microcontroller with 28 terminals, operating at 20 MHz max frequency. It features 6-Ch 10-Bit ADCs, SPI and UART connectivity, and FLASH ROM programmability. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and compact size (5x5 mm).

Median Price

$1.586

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.290

10k+ parts

$1.150

1,500

-

$1.560

$1.290

$1.150

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.613

10k+ parts

$1.438

1,500

-

-

$1.613

$1.438

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,297 parts In-Stock

1+ parts

$1.216

100+ parts

-

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-

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2,297

$1.216

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-

Vyrian

USA . 4,369 parts In-Stock

1+ parts

-

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4,369

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 517 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

$0.177

517

$0.184

-

-

$0.177

Northwest PG Solutions

USA . 2,144 parts In-Stock

1+ parts

$0.202

100+ parts

-

1k+ parts

-

10k+ parts

$0.178

2,144

$0.202

-

-

$0.178

Corphita

USA . 1,050 parts In-Stock

1+ parts

$1.152

100+ parts

-

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-

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-

1,050

$1.152

-

-

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Corohmni

South Africa . 284 parts In-Stock

1+ parts

$1.280

100+ parts

-

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284

$1.280

-

-

-

AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$8.120

100+ parts

-

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-

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590

$8.120

-

-

-

Kulean Microsystems

USA . 5,651 parts In-Stock

1+ parts

-

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5,651

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SupplyDigital Components

Austria . 5,367 parts In-Stock

1+ parts

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5,367

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TANS Electronics

Latvia . 3,490 parts In-Stock

1+ parts

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3,490

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Continental Prestige Electronics

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$1.070

1k+ parts

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1,500

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$1.070

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Kepictronics

USA . 948 parts In-Stock

1+ parts

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948

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Problanco Electronics

Mexico . 366 parts In-Stock

1+ parts

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366

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UHIMA Technologies

Türkiye . 307 parts In-Stock

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307

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Microchip USA

USA . 186 parts In-Stock

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186

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Overview

Discover the power of the Onsemi AX8052F100-2-TA05 microcontroller, a cutting-edge solution designed to elevate your projects to new heights. With a wide range of peripherals and high-quality technology, this device offers unmatched performance and reliability for industrial applications. From its compact size to its impressive clock frequency, this microcontroller provides unparalleled value and versatility. Trust Onsemi's expertise and innovation to bring your ideas to life with the AX8052F100-2-TA05.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy integration onto a circuit board, making it convenient for manufacturing and assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power input options, making it suitable for a variety of applications.

Package Shape: SQUARE

The square package shape enables efficient use of space on the circuit board, especially in compact designs.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and versatility in interfacing with external components.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and operation at lower voltage levels.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand elevated temperatures without compromising performance.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this product is designed to integrate various peripherals and functions into a single chip, providing efficient processing capabilities.

Technical Specifications

Microcontrollers AX8052F100-2-TA05 attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

24

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8448

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(2), POR, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

AX8052F100-2-TA05 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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