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74VCX00MX

Onsemi

74VCX00MX by Onsemi

74VCX00MX by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 2.8 ns at Vsup of 1.5V, suitable for industrial applications requiring fast signal processing in compact designs. This small outline package with surface mount feature operates b/w -40 to 85 °C temperature range.

Median Price

$0.276

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 193,281 parts In-Stock

1+ parts

-

100+ parts

$0.298

1k+ parts

$0.247

10k+ parts

$0.221

193,281

-

$0.298

$0.247

$0.221

Verical

USA . 164,926 parts In-Stock

1+ parts

-

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$0.276

164,926

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$0.276

DigiKey

USA . 62,733 parts In-Stock

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$0.170

62,733

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$0.170

Flip Electronics (Authorized)

USA . 62,733 parts In-Stock

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62,733

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Digiode

USA . 1,446 parts In-Stock

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$0.317

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$0.317

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Vyrian

USA . 2,169 parts In-Stock

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$0.319

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$0.319

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DigiKey Marketplace

USA . 164,926 parts In-Stock

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164,926

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Flip Electronics

USA . 62,733 parts In-Stock

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62,733

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Chip Stock

USA . 9,922 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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R&J Components

USA . 2,251 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,945 parts In-Stock

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$0.301

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$0.301

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Corohmni

South Africa . 196 parts In-Stock

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$0.319

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$0.319

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Native Components

USA . 191 parts In-Stock

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$15.874

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191

$15.874

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Northwest PG Solutions

USA . 1,397 parts In-Stock

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$17.461

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$15.715

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1,397

$17.461

$15.715

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Continental Prestige Electronics

USA . 32,500 parts In-Stock

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$0.242

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$0.242

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 5,635 parts In-Stock

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Microchip USA

USA . 4,958 parts In-Stock

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Kulean Microsystems

USA . 3,802 parts In-Stock

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Supply Digital

USA . 2,789 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Assy Fe

Spain . 1,531 parts In-Stock

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SupplyDigital Components

Austria . 957 parts In-Stock

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TANS Electronics

Latvia . 886 parts In-Stock

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UHIMA Technologies

Türkiye . 29 parts In-Stock

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Overview

Elevate your projects with the 74VCX00MX Logic Gates from Onsemi - a top-tier manufacturer renowned for cutting-edge technology and superior quality. This versatile component offers lightning-fast propagation delays, low power consumption, and a compact design perfect for space-constrained applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this innovative solution delivers unmatched performance and reliability. Upgrade your circuits today and experience the seamless integration and exceptional value that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 2.8 ns

Offers fast response time, making the logic gates suitable for high-speed applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

No. of Functions: 4

Capable of performing multiple functions within a single component, optimizing circuit design and saving space.

Nominal Supply Voltage / Vsup (V): 1.5

Operates efficiently at a low voltage, reducing power consumption and heat dissipation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Logic Gates 74VCX00MX attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.6235 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2.8 ns

Propagation Delay (tpd):

37 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.753 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74VCX00MX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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