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74HC14DR2G

Onsemi

74HC14DR2G by Onsemi

74HC14DR2G by Onsemi is a CMOS Logic Gates IC with 6 functions. It has a propagation delay of 22ns at Vsup=3V, making it ideal for fast response applications. With Schmitt Trigger technology and operating temperature range of -55 to 125 °C, it is suitable for military-grade electronics.

Median Price

$0.102

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,172 parts In-Stock

1+ parts

$0.102

100+ parts

$0.096

1k+ parts

$0.087

10k+ parts

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1,172

$0.102

$0.096

$0.087

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Distributors (In-Stock)

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Digiode

USA . 1,445 parts In-Stock

1+ parts

$0.097

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1,445

$0.097

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Component Electronics Inc.

Canada . 2,019 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

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$2.000

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2,019

$3.080

$2.310

$2.000

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Chip Stock

USA . 291,400 parts In-Stock

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291,400

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Velocity Electronics

USA . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 2,070 parts In-Stock

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2,070

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ComSIT Distribution GmbH

Germany . 440 parts In-Stock

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440

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Distributors (Availability)

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Corphita

USA . 1,792 parts In-Stock

1+ parts

$0.092

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1,792

$0.092

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Corohmni

South Africa . 282 parts In-Stock

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$0.102

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282

$0.102

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AZTECH Wire

Italy . 369 parts In-Stock

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$12.980

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369

$12.980

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Microchip USA

USA . 5,186 parts In-Stock

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SupplyDigital Components

Austria . 2,256 parts In-Stock

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TANS Electronics

Latvia . 951 parts In-Stock

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951

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Northwest PG Solutions

USA . 809 parts In-Stock

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UHIMA Technologies

Türkiye . 790 parts In-Stock

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790

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Native Components

USA . 369 parts In-Stock

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369

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Kulean Microsystems

USA . 116 parts In-Stock

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Problanco Electronics

Mexico . 17 parts In-Stock

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Overview

Enhance your electronic projects with the 74HC14DR2G by Onsemi! Manufactured by a trusted name in the industry, this logic gates device offers reliable performance and high-quality construction. Ideal for a wide range of applications, this product is designed to provide fast propagation delays and efficient operation. With its compact package style and versatile terminal configuration, the 74HC14DR2G is a valuable addition to any project. Upgrade your work with this top-of-the-line component from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Propagation Delay At Nominal Supply: 22 ns

The low propagation delay at nominal supply ensures fast signal processing within the logic gates, making them suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Functions: 6

Having multiple functions in one device increases functionality and efficiency, reducing the need for multiple individual components.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the product energy-efficient, suitable for battery-powered devices.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for effective signal transmission and reception, ensuring reliable performance.

Power Supplies (V): 2/6

Supporting power supplies of 2V to 6V provides flexibility in different operating conditions and voltage levels.

No. of Terminals: 14

Having 14 terminals offers versatility in connectivity options, allowing for complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum I (ol): 4 Amp

The high maximum output current of 4A ensures the logic gates can drive a variety of loads without the risk of damage.

Propagation Delay (tpd): 110 ns

Although slightly higher, the propagation delay of 110ns is still within acceptable limits for most applications, balancing speed and performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high temperatures, suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C allows the product to function reliably in extreme cold environments.

Terminal Finish: TIN

The use of tin as the terminal finish provides good electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and design, allowing for different mounting orientations.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm reduces the overall profile of the product, ideal for slim and compact devices.

Width: 3.9 mm

The narrow width of 3.9mm saves space on the PCB, enabling high-density circuit designs.

Minimum Supply Voltage (Vsup): 2V

The product can operate at a minimum supply voltage of 2V, ensuring compatibility with low-power electronics and applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand the soldering process during assembly without damage.

Length: 8.65 mm

The compact length of 8.65mm contributes to the overall small form factor of the product, suitable for space-constrained applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions and demanding applications.

Schmitt Trigger: YES

Having a Schmitt trigger allows for cleaner and more stable signal transitions, reducing noise and improving signal integrity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering, ensuring robust connections on the PCB.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the product, preventing damage during handling and shipping.

Terminal Pitch: 1.27 mm

The tight terminal pitch of 1.27mm enables high-density mounting on the PCB, maximizing the use of available space.

Maximum Supply Voltage (Vsup): 6V

Supporting a maximum supply voltage of 6V allows the product to be used in a wide range of voltage scenarios, increasing its versatility.

Technical Specifications

Logic Gates 74HC14DR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74HC14DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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