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74FST3257DTR2

Onsemi

74FST3257DTR2 by Onsemi

The Onsemi 74FST3257DTR2 is a bus driver & transceiver with 4 functions, 2 inputs, and 3-state output. It operates at a supply voltage of 5V, has a propagation delay of 0.25ns, and supports bidirectional count direction. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,808 parts In-Stock

1+ parts

$0.120

100+ parts

$0.120

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$0.120

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9,808

$0.120

$0.120

$0.120

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 667 parts In-Stock

1+ parts

$0.114

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-

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667

$0.114

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Vyrian

USA . 2,817 parts In-Stock

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2,817

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Distributors (Availability)

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Corphita

USA . 1,744 parts In-Stock

1+ parts

$0.108

100+ parts

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1,744

$0.108

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Corohmni

South Africa . 211 parts In-Stock

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$0.120

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211

$0.120

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AZTECH Wire

Italy . 1,070 parts In-Stock

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$21.550

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1,070

$21.550

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Component Stockers USA

USA . 731 parts In-Stock

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$99.990

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731

$99.990

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Native Components

USA . 744 parts In-Stock

1+ parts

$189.630

100+ parts

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10k+ parts

$182.045

744

$189.630

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$182.045

Northwest PG Solutions

USA . 211 parts In-Stock

1+ parts

$208.593

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211

$208.593

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Problanco Electronics

Mexico . 8,204 parts In-Stock

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8,204

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 3,037 parts In-Stock

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3,037

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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1,970

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TANS Electronics

Latvia . 1,880 parts In-Stock

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1,880

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Kulean Microsystems

USA . 929 parts In-Stock

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929

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UHIMA Technologies

Türkiye . 829 parts In-Stock

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829

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Microchip USA

USA . 120 parts In-Stock

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120

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Overview

Unlock seamless data transmission and power efficiency with the 74FST3257DTR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Bus Driver & Transceivers that cater to various applications. With its advanced technology and reliable performance, this product offers unmatched value and benefits to customers. Experience improved signal integrity and versatility in your projects with the 74FST3257DTR2, a game-changer in the world of electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for rugged environments.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving design, making it efficient for compact applications.

No. of Functions: 4

Having 4 functions in one product increases functionality and versatility, providing value for money.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with most systems and easy to integrate.

Propagation Delay (tpd): 0.25 ns

Low propagation delay ensures fast and efficient signal transmission, reducing latency in communication.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility in controlling the output signal.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Bus Driver & Transceivers 74FST3257DTR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74FST3257DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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