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74FST3257DR2

Onsemi

74FST3257DR2 by Onsemi

74FST3257DR2 by Onsemi is a 4-function bus driver with 2 inputs, operating at a supply voltage of 5V. It features a propagation delay of 0.25ns and output characteristics in the form of 3-STATE. This industrial-grade transceiver is ideal for bidirectional applications requiring true output polarity control.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,444 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

2,444

-

$0.172

$0.143

$0.127

Verical

USA . 2,444 parts In-Stock

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-

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$0.159

2,444

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-

-

$0.159

Distributors (In-Stock)

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Digiode

USA . 2,217 parts In-Stock

1+ parts

$0.134

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2,217

$0.134

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Vyrian

USA . 2,469 parts In-Stock

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2,469

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Distributors (Availability)

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Corphita

USA . 660 parts In-Stock

1+ parts

$0.127

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660

$0.127

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Corohmni

South Africa . 223 parts In-Stock

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$0.141

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223

$0.141

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AZTECH Wire

Italy . 884 parts In-Stock

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$13.130

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884

$13.130

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Native Components

USA . 707 parts In-Stock

1+ parts

$76.350

100+ parts

-

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$73.296

707

$76.350

-

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$73.296

Northwest PG Solutions

USA . 1,222 parts In-Stock

1+ parts

$83.985

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1,222

$83.985

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QUARKTWIN TECHNOLOGY LTD

USA . 13,740 parts In-Stock

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13,740

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Kulean Microsystems

USA . 7,730 parts In-Stock

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7,730

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TANS Electronics

Latvia . 6,392 parts In-Stock

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Microchip USA

USA . 5,567 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Continental Prestige Electronics

USA . 4,944 parts In-Stock

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$0.126

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4,944

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$0.126

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SupplyDigital Components

Austria . 3,839 parts In-Stock

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3,839

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Problanco Electronics

Mexico . 2,094 parts In-Stock

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UHIMA Technologies

Türkiye . 688 parts In-Stock

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688

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Overview

Discover the unbeatable quality and reliability of the 74FST3257DR2 by Onsemi, a top-notch Bus Driver & Transceiver. With a focus on innovation and cutting-edge technology, Onsemi delivers exceptional products that exceed expectations. This versatile component is perfect for a wide range of applications, offering seamless functionality and outstanding performance. Trust Onsemi to provide you with the best solutions for all your electronic needs, ensuring maximum value and efficiency every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in providing durability and protection to the internal components of the bus driver & transceivers.

Surface Mount: YES

Surface mount capability makes it easy to integrate this product into various electronic devices efficiently.

No. of Functions: 4

Having multiple functions in one device increases its versatility and usefulness in different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of electronic systems.

Propagation Delay (tpd): 0.25 ns

Low propagation delay enables fast and efficient data transmission, making this product suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74FST3257DR2 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

74FST3257DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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