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74ALVCH16373DTR

Onsemi

74ALVCH16373DTR by Onsemi

74ALVCH16373DTR by Onsemi is a Bus Driver & Transceiver with 3ns Propagation Delay, 8-bit data width, and 24A Max I (ol). It operates at a Nominal Voltage of 3.3V and is ideal for industrial applications requiring high-speed signal transmission in compact spaces.

Median Price

$0.292

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27,400 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

27,400

-

$0.304

$0.252

$0.225

Verical

USA . 27,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.281

27,400

-

-

-

$0.281

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,195 parts In-Stock

1+ parts

$0.237

100+ parts

-

1k+ parts

-

10k+ parts

-

2,195

$0.237

-

-

-

DF Sales Co.

USA . 370 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$0.280

-

-

-

DF Sales Co.

USA . 370 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

-

370

$0.280

-

-

-

Vyrian

USA . 3,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,394

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$0.213

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$0.213

-

-

-

Corphita

USA . 1,905 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

-

10k+ parts

-

1,905

$0.224

-

-

-

AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$18.560

100+ parts

-

1k+ parts

-

10k+ parts

-

323

$18.560

-

-

-

Native Components

USA . 252 parts In-Stock

1+ parts

$76.146

100+ parts

-

1k+ parts

-

10k+ parts

$73.100

252

$76.146

-

-

$73.100

Northwest PG Solutions

USA . 919 parts In-Stock

1+ parts

$83.761

100+ parts

-

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10k+ parts

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919

$83.761

-

-

-

Continental Prestige Electronics

USA . 27,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.213

10k+ parts

-

27,400

-

-

$0.213

-

Problanco Electronics

Mexico . 6,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,662

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Kulean Microsystems

USA . 5,916 parts In-Stock

1+ parts

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5,916

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TANS Electronics

Latvia . 5,906 parts In-Stock

1+ parts

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5,906

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SupplyDigital Components

Austria . 964 parts In-Stock

1+ parts

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964

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Microchip USA

USA . 250 parts In-Stock

1+ parts

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250

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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100+ parts

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119

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Overview

Discover the cutting-edge 74ALVCH16373DTR by Onsemi, a top-tier bus driver & transceiver that guarantees unparalleled quality and performance. With a reputation for excellence, Onsemi delivers innovative solutions for a wide range of applications. This product offers customers exceptional value, benefits, and advantages, making it the go-to choice for seamless data transmission. Upgrade your systems with the 74ALVCH16373DTR and experience reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 3 ns

The low propagation delay ensures quick and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in one component offers flexibility and cost-effectiveness in system design.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space on the PCB and is compatible with standard mounting techniques.

Nominal Supply Voltage / Vsup (V): 3.3

The specified nominal supply voltage ensures compatibility with most systems and power sources, making it versatile in various applications.

Load Capacitance (CL): 30 pF

The specified load capacitance helps in determining the amount of load the driver can handle, ensuring optimal performance.

Power Supplies (V): 3.3

Having a consistent power supply voltage ensures stable operation and reliable performance of the product.

No. of Terminals: 48

Having a high number of terminals allows for more connectivity options and flexibility in configuring the device.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB and enables dense PCB layouts, suitable for miniaturized designs.

Maximum I (ol): 24 Amp

The high output current capability allows the driver to effectively drive loads with varying power requirements.

Propagation Delay (tpd): 7.8 ns

The specified propagation delay determines the speed of data transmission, ensuring efficient communication within the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in various settings.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional flexibility in controlling the output signals, allowing for tri-state logic operation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function effectively in extreme cold environments without performance degradation.

Terminal Finish: TIN LEAD

Having a tin lead terminal finish ensures good solderability and conductivity, making it easy to solder onto the PCB.

Terminal Position: DUAL

The dual terminal position offers additional connectivity options and facilitates easier connections within the system.

No. of Ports: 2

Having multiple ports allows for more input/output connections, enhancing the versatility and functionality of the product.

Maximum Seated Height: 1.1 mm

The low seated height makes the product suitable for space-constrained applications where height clearance is limited.

Width: 6.1 mm

The compact width dimensions contribute to a smaller footprint on the PCB, making it ideal for designs with limited space.

Output Polarity: TRUE

Having a true output polarity simplifies interfacing with other components and ensures compatibility in digital systems.

Minimum Supply Voltage (Vsup): 2.3 V

The specified minimum supply voltage ensures the product can operate effectively even with low power sources, enhancing its versatility.

Peak Reflow Temperature °C: 235

The high peak reflow temperature capability allows for reliable soldering during assembly processes, ensuring a robust connection.

Length: 12.5 mm

The compact length dimensions contribute to a smaller overall size of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments with varying temperature conditions.

Technology: CMOS

Being based on CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable and robust connection to the PCB, ensuring secure mounting and electrical contact.

Packing Method: TR

The TR packing method offers convenient handling, storage, and transportation of the product, ensuring its protection during distribution.

Terminal Pitch: 0.5 mm

The specified terminal pitch allows for precise placement and soldering of the component onto the PCB, ensuring accurate connections.

Maximum Supply Voltage (Vsup): 3.6 V

The specified maximum supply voltage ensures the product remains within safe operating limits, protecting it from voltage spikes or overloads.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16373DTR attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ALVCH16373DTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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