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1PMT5921BT3

Onsemi

1PMT5921BT3 by Onsemi

1PMT5921BT3 by Onsemi is a Zener diode with a nominal reference voltage of 6.8V and max power dissipation of 0.5W. It operates at a max temperature of 150 °C, has a working test current of 55.1mA, and features a small outline package style for various applications in electronics circuits requiring voltage regulation.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,084 parts In-Stock

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Digiode

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Problanco Electronics

Mexico . 8,205 parts In-Stock

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TANS Electronics

Latvia . 7,868 parts In-Stock

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SupplyDigital Components

Austria . 6,915 parts In-Stock

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Kulean Microsystems

USA . 1,474 parts In-Stock

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UHIMA Technologies

Türkiye . 804 parts In-Stock

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Native Components

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Corphita

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Northwest PG Solutions

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Corohmni

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Overview

Unlock the power of precision with the 1PMT5921BT3 Zener Diode by Onsemi. Crafted with superior quality and expertise, this single-configured diode offers unparalleled reliability in a small outline package. Ideal for voltage regulation and protection in various electronic circuits, this Zener diode ensures stable performance with a maximum voltage tolerance of 5%. Experience peace of mind knowing your devices are safeguarded with the 1PMT5921BT3, delivering value and efficiency to every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the zener diode, making it suitable for various applications.

Working Test Current: 55.1 mA

The high working test current allows for reliable performance and operation under specified conditions.

Surface Mount: YES

Being surface mountable makes the installation of this zener diode easier and more convenient in modern electronic devices.

Maximum Voltage Tolerance: 5 %

With a tight voltage tolerance, this zener diode ensures accuracy in voltage regulation and protection of downstream circuits.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for stable performance even in demanding environments.

Maximum Dynamic Impedance: 2.5 ohm

Low dynamic impedance ensures efficient regulation and minimal power loss in the circuit.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and ensures a reliable electrical connection.

Maximum Power Dissipation: 0.5 W

With a high maximum power dissipation, this zener diode can handle moderate power levels without overheating.

Nominal Reference Voltage: 6.8 V

The specific reference voltage of 6.8V makes this zener diode suitable for applications requiring a stable voltage reference.

Technology: ZENER

Utilizing Zener technology, this diode provides precise voltage regulation and protection in electronic circuits.

Technical Specifications

Zener Diodes 1PMT5921BT3 attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

2.5 ohm

JEDEC-95 Code:

DO-216AA

JESD-30 Code:

S-PSSO-G1

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

1

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

.5 W

Qualification:

Not Qualified

Nominal Reference Voltage:

6.8 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

55.1 mA

Trade Compliance

1PMT5921BT3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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