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XPC8260VVIFBC

NXP Semiconductors

XPC8260VVIFBC by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;

Median Price

$207.018

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

XPC8260VVIFBC by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 682 parts In-Stock

1+ parts

$182.830

100+ parts

$171.860

1k+ parts

$160.890

10k+ parts

-

682

$182.830

$171.860

$160.890

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DigiKey

USA . 598 parts In-Stock

1+ parts

$228.540

100+ parts

-

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-

10k+ parts

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598

$228.540

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Farnell

UK . 598 parts In-Stock

1+ parts

-

100+ parts

$199.210

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598

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$199.210

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Verical

USA . 471 parts In-Stock

1+ parts

-

100+ parts

$214.825

1k+ parts

-

10k+ parts

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471

-

$214.825

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,091 parts In-Stock

1+ parts

$165.424

100+ parts

-

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4,091

$165.424

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Vyrian

USA . 4,466 parts In-Stock

1+ parts

$174.130

100+ parts

-

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4,466

$174.130

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Anansix

USA . 2,744 parts In-Stock

1+ parts

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2,744

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DigiKey Marketplace

USA . 682 parts In-Stock

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682

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ComSIT Distribution GmbH

Germany . 124 parts In-Stock

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124

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LIBRA Elektronik GmbH

Germany . 14 parts In-Stock

1+ parts

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14

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Infinite Electronics LLP

India . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 4 parts In-Stock

1+ parts

$7.500

100+ parts

-

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4

$7.500

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Microchip USA

USA . 2,153 parts In-Stock

1+ parts

$130.392

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2,153

$130.392

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Corphita

USA . 4,945 parts In-Stock

1+ parts

$156.717

100+ parts

-

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4,945

$156.717

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Component Stockers USA

USA . 500 parts In-Stock

1+ parts

$217.650

100+ parts

$204.590

1k+ parts

-

10k+ parts

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500

$217.650

$204.590

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QUARKTWIN TECHNOLOGY LTD

USA . 21,472 parts In-Stock

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21,472

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A-Z Elektronik GmbH

Germany . 7,290 parts In-Stock

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7,290

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UNI Independent Distributors

Spain . 1,960 parts In-Stock

1+ parts

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1,960

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GreenTree Electronics

Israel . 63 parts In-Stock

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63

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Technical Specifications

Microprocessors XPC8260VVIFBC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.66 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B480

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

480

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

1.65 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

XPC8260VVIFBC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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