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UJA1162TK,118

NXP Semiconductors

UJA1162TK,118 by NXP Semiconductors

UJA1162TK,118 by NXP Semiconductors is a CAN transceiver designed for automotive applications. It features a data rate of 1 Mbps, operates b/w 4.5-28V, and has a compact 14-terminal SO package. Its AEC-Q100 screening ensures reliability in harsh environments.

Median Price

$1.590

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,845 parts In-Stock

1+ parts

-

100+ parts

$1.590

1k+ parts

$1.320

10k+ parts

$1.180

5,845

-

$1.590

$1.320

$1.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,487 parts In-Stock

1+ parts

-

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6,487

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Flip Electronics

USA . 5,845 parts In-Stock

1+ parts

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5,845

-

-

-

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Digiode

USA . 3,677 parts In-Stock

1+ parts

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3,677

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Greenchips

USA . 314 parts In-Stock

1+ parts

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1k+ parts

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314

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SIE Connect GmbH - GreenChips

Germany . 314 parts In-Stock

1+ parts

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314

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Anansix

USA . 73 parts In-Stock

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73

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 342 parts In-Stock

1+ parts

$2.960

100+ parts

-

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342

$2.960

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AZTECH Wire

Italy . 152 parts In-Stock

1+ parts

$17.890

100+ parts

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152

$17.890

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One Stop Electronics

USA . 951 parts In-Stock

1+ parts

$77.000

100+ parts

-

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951

$77.000

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UNI Independent Distributors

Spain . 8,376 parts In-Stock

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8,376

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Corphita

USA . 2,161 parts In-Stock

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2,161

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Overview

Elevate your automotive and industrial connectivity with the UJA1162TK,118 by NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP ensures this CAN transceiver delivers outstanding reliability and performance. With a robust design to withstand harsh conditions, it streamlines communication in vehicle networks and smart systems. Experience enhanced data rates and energy efficiency, empowering your applications for seamless integration and long-lasting value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protects the internal components from environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more compact integration onto PCBs, optimizing space and enhancing manufacturability.

Screening Level: AEC-Q100

Meeting AEC-Q100 screening standards implies that this component is reliable for automotive applications, ensuring high quality and performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape facilitates straightforward placement in a variety of layouts, supporting design flexibility in electronic applications.

Power Supplies (V): 4.5/28

The wide voltage supply range of 4.5 to 28V allows for versatility in design, making the product compatible with different system power requirements.

No. of Terminals: 14

With 14 terminals, this product offers sufficient connectivity options, enhancing its functionality in networking applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact and lightweight design, essential for space-constrained applications.

Terminal Position: DUAL

Dual terminal positioning provides reliability and ensures stable connections, which is critical for maintaining signal integrity in communication networks.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures that the component can withstand industry-standard soldering processes without compromising its integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C signifies robustness against high-temperature soldering processes, guaranteeing reliability during assembly.

Terminal Form: NO LEAD

The no-lead terminal form reduces the overall footprint, minimizes solder usage, and improves thermal performance, making it ideal for compact designs.

Maximum Supply Current: 0.081 mA

A low maximum supply current of 0.081 mA allows for energy-efficient operation, which is crucial for battery-powered or low-power applications.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, this product is specifically designed for reliable communication in automotive and industrial networking, making it a strong choice for such applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm enables tight packing of components, enhancing design efficiency and compatibility with high-density circuits.

Data Rate: 1 Mbps

Supporting a data rate of 1 Mbps ensures efficient and fast data transmission, suitable for real-time communication applications.

Technical Specifications

Network Interfaces UJA1162TK,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-N14

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC14,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Network Interfaces

Maximum Supply Current:

.081 mA

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

UJA1162TK,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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