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UJA1078ATW/3V3,118

NXP Semiconductors

UJA1078ATW/3V3,118 by NXP Semiconductors

UJA1078ATW/3V3,118 by NXP is a CAN transceiver designed for automotive applications, featuring a data rate of 1 Mbps and operating temp range from -40 °C to 125 °C. It supports power supplies b/w 4.5V and 28V with AEC-Q100 screening. This compact device has a small outline package with 32 terminals for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 3,995 parts In-Stock

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3,995

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Digiode

USA . 4,374 parts In-Stock

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Flip Electronics

USA . 3,995 parts In-Stock

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3,995

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Vyrian

USA . 3,341 parts In-Stock

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Anansix

USA . 1,606 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 567 parts In-Stock

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$18.940

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567

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Component Stockers USA

USA . 406 parts In-Stock

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$99.990

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406

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One Stop Electronics

USA . 382 parts In-Stock

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$596.000

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QUARKTWIN TECHNOLOGY LTD

USA . 25,591 parts In-Stock

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Microchip USA

USA . 4,267 parts In-Stock

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UNI Independent Distributors

Spain . 4,050 parts In-Stock

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Corphita

USA . 1,920 parts In-Stock

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Overview

Unlock the power of connectivity with the UJA1078ATW/3V3,118 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a robust CAN transceiver that excels in automotive applications. Designed for durability in extreme temperatures, this versatile device enhances network performance while ensuring reliability. Experience seamless communication and elevate your projects with unparalleled support and performance, making it the ideal choice for your next breakthrough.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating integration into space-constrained applications.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high reliability and performance, making it ideal for automotive and critical applications.

Package Shape: RECTANGULAR

The rectangular shape is standard for many applications, allowing for easy mounting and PCB layout.

Power Supplies (V): 4.5/28

This wide voltage range ensures compatibility with various power supply systems in automotive and industrial settings.

No. of Terminals: 32

A higher number of terminals allows for more functional connections, supporting complex circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style optimizes space while providing effective heat dissipation, crucial for maintaining performance in high-power applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures increases reliability in harsh environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

This low operating temperature extends the product's applicability to extreme conditions and environments.

Terminal Finish: MATTE TIN

Matte tin provides good solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positions enhance the flexibility of PCB layout and connection configurations.

Maximum Seated Height: 1.1 mm

A low seated height minimizes the overall profile of the component, making it suitable for slim devices.

Width: 6.1 mm

A compact width allows for space-efficient PCB designs, making the product ideal for dense circuit layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature supports reliable soldering processes in manufacturing, promoting better assembly outcomes.

Length: 11 mm

A manageable length allows for versatile placement on PCBs without compromising space for other components.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring the product meets stringent industry standards for safety and reliability.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy automated PCB assembly, reducing manufacturing costs and time.

Maximum Supply Current: 0.000099 mA

Ultra-low supply current ensures energy efficiency, making it an excellent choice for battery-powered applications.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, this product is ideal for communication within automotive networks, enhancing vehicle functionality.

Nominal Supply Voltage: 14 V

The nominal supply voltage is well-suited for automotive systems that typically operate around this value.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for more terminals in a compact space, enhancing device functionality without increasing size.

Data Rate: 1 Mbps

Supports high-speed data communication, crucial for efficient performance in automotive and industrial applications.

Technical Specifications

Network Interfaces UJA1078ATW/3V3,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000099 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1078ATW/3V3,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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