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UJA1075ATW/5V0WD,1

NXP Semiconductors

UJA1075ATW/5V0WD,1 by NXP Semiconductors

UJA1075ATW/5V0WD,1 from NXP is an automotive CAN transceiver with a data rate of 1 Mbps and operates b/w -40 °C to 125 °C. It features a compact 32-terminal design in a thin profile package. Ideal for network interfaces in automotive applications, it supports power supplies from 4.5V to 28V.

Median Price

$4.654

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

$4.704

100+ parts

$4.604

1k+ parts

$2.746

10k+ parts

$2.746

2,000

$4.704

$4.604

$2.746

$2.746

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$4.604

1k+ parts

$2.746

10k+ parts

$2.746

2,000

-

$4.604

$2.746

$2.746

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,373 parts In-Stock

1+ parts

$4.469

100+ parts

-

1k+ parts

-

10k+ parts

-

3,373

$4.469

-

-

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Flip Electronics

USA . 190,000 parts In-Stock

1+ parts

-

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190,000

-

-

-

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Vyrian

USA . 4,989 parts In-Stock

1+ parts

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4,989

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Anansix

USA . 2,885 parts In-Stock

1+ parts

-

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2,885

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VRG Components

USA . 2,000 parts In-Stock

1+ parts

-

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2,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,794 parts In-Stock

1+ parts

$4.234

100+ parts

-

1k+ parts

-

10k+ parts

-

3,794

$4.234

-

-

-

AZTECH Wire

Italy . 399 parts In-Stock

1+ parts

$16.000

100+ parts

-

1k+ parts

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10k+ parts

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399

$16.000

-

-

-

Microchip USA

USA . 3,182 parts In-Stock

1+ parts

$19.069

100+ parts

-

1k+ parts

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10k+ parts

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3,182

$19.069

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Component Stockers USA

USA . 3,412 parts In-Stock

1+ parts

$39.020

100+ parts

-

1k+ parts

-

10k+ parts

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3,412

$39.020

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-

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Perfect Parts

USA . 20,160 parts In-Stock

1+ parts

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100+ parts

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20,160

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QUARKTWIN TECHNOLOGY LTD

USA . 16,004 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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16,004

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Kepictronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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UNI Independent Distributors

Spain . 5,718 parts In-Stock

1+ parts

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5,718

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Unlock unparalleled performance with the UJA1075ATW/5V0WD,1 from NXP Semiconductors—your go-to solution for advanced network interfaces. Renowned for their quality and innovation, NXP ensures this CAN transceiver supports a wide range of automotive applications while delivering exceptional reliability in extreme conditions. Experience seamless connectivity, enhanced durability, and peace of mind, knowing you’re backed by industry-leading expertise. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material contributes to the robustness of the product, making it suitable for various environmental conditions.

Surface Mount: YES

Being a surface mount device allows for easier assembly and integration into smaller circuit boards, enhancing design flexibility.

Screening Level: AEC-Q100

Meets the AEC-Q100 screening level standard, ensuring high reliability for automotive applications and reducing the risk of component failure.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCB layouts, improving the overall design and increasing component density.

Power Supplies (V): 4.5/28

Supports a wide voltage range (4.5V to 28V), making the product versatile and compatible with various power supply systems.

No. of Terminals: 32

A 32-terminal design provides multiple connection options, enabling more complex functionality within a compact footprint.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This small outline package style helps in heat dissipation and allows for efficient thermal management, crucial for high-performance applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can function reliably in harsh conditions, typical in automotive environments.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold conditions (-40 °C), ensuring reliability across a wide range of operational environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and ensures strong electrical connections for consistent performance.

Terminal Position: DUAL

Dual terminal positions allow for flexible PCB layout options and simplified interfacing with other components.

Maximum Seated Height: 1.1 mm

A low seated height allows for a compact design, making the product suitable for space-constrained applications.

Width: 6.1 mm

Compact width aids in fitting the device into tight spaces within electronic assemblies, enhancing overall design efficiency.

Peak Reflow Temperature °C: 260

Rated for a high peak reflow temperature, this device can withstand the thermal stresses of reflow soldering processes.

Length: 11 mm

A moderate length that balances compactness with functionality, suitable for various application needs.

Temperature Grade: AUTOMOTIVE

Specifically graded for automotive use, ensuring reliability and performance in critical automotive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and enable reliable solder connections, ensuring longevity and stability.

Maximum Supply Current: 0.000098 mA

Very low power consumption (0.000098 mA) makes it energy-efficient and suitable for battery-operated devices.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, it supports robust communication in automotive and industrial applications, essential for reliable data exchange.

Nominal Supply Voltage: 14 V

Works optimally at a nominal supply voltage of 14V, making it ideal for standard automotive voltage levels.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for smaller PCB designs while still providing sufficient spacing for soldering.

Data Rate: 1 Mbps

A data rate of 1 Mbps enables rapid communication in control systems, making it suitable for real-time applications.

Technical Specifications

Network Interfaces UJA1075ATW/5V0WD,1 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000098 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1075ATW/5V0WD,1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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