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UJA1075ATW/3V3WD,1

NXP Semiconductors

UJA1075ATW/3V3WD,1 by NXP Semiconductors

UJA1075ATW/3V3WD,1 from NXP is a CAN transceiver designed for automotive applications, operating b/w -40 °C to 125 °C. It features a 32-terminal small outline package and supports data rates up to 1 Mbps with a nominal voltage of 14 V. Ideal for robust network interfaces in vehicles, it meets AEC-Q100 standards.

Median Price

$3.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$3.070

1k+ parts

$2.750

10k+ parts

$2.580

2,000

-

$3.070

$2.750

$2.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,874 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,874

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Digiode

USA . 3,250 parts In-Stock

1+ parts

-

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3,250

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Anansix

USA . 2,028 parts In-Stock

1+ parts

-

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2,028

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

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1k+ parts

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2,000

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,088 parts In-Stock

1+ parts

$12.320

100+ parts

-

1k+ parts

-

10k+ parts

-

1,088

$12.320

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Component Stockers USA

USA . 2,826 parts In-Stock

1+ parts

$41.640

100+ parts

-

1k+ parts

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10k+ parts

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2,826

$41.640

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One Stop Electronics

USA . 646 parts In-Stock

1+ parts

$733.000

100+ parts

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646

$733.000

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Perfect Parts

USA . 7,842 parts In-Stock

1+ parts

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7,842

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Microchip USA

USA . 6,657 parts In-Stock

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6,657

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UNI Independent Distributors

Spain . 1,831 parts In-Stock

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1,831

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Corphita

USA . 580 parts In-Stock

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580

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Overview

Elevate your automotive designs with the UJA1075ATW/3V3WD from NXP Semiconductors, a leader in high-quality network interfaces. Engineered for reliability under extreme conditions, this CAN transceiver ensures seamless communication, enhancing system efficiency and safety. With its compact design and robust performance, it’s perfect for advanced automotive applications. Trust in NXP’s expertise to deliver unmatched value, ensuring your projects thrive in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on printed circuit boards, enabling more design flexibility.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates reliability and robustness, making it an excellent choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape aids in easy placement on PCBs, optimizing layout and efficiency in assembly processes.

Power Supplies (V): 4.5/28

Wide voltage supply range allows for versatile use across various applications, enhancing compatibility with multiple systems.

No. of Terminals: 32

A higher number of terminals provides extensive connectivity options, facilitating integration into complex network configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style supports better heat dissipation and efficient use of space, making it ideal for modern, compact electronic designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in demanding environments, particularly in automotive settings.

Minimum Operating Temperature: -40 °C

The product's ability to function in low temperatures ensures consistent performance in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides protection against oxidation, prolonging the product's lifespan.

Terminal Position: DUAL

Dual terminal positions increase flexibility in circuit design and layout, accommodating various assembly techniques.

Maximum Seated Height: 1.1 mm

Low seated height contributes to a compact overall design, essential for space-constrained applications.

Width: 6.1 mm

Narrow width is advantageous for layouts where space is at a premium, allowing for denser circuit designs.

Peak Reflow Temperature °C: 260

A high reflow temperature compatibility ensures the component can withstand the soldering process without degradation.

Length: 11 mm

A modest length aids in fitting within the compact designs of modern electronics without sacrificing performance.

Temperature Grade: AUTOMOTIVE

This temperature grade signifies that the component is designed to meet rigorous automotive standards, ensuring reliability and safety.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and allow for better mechanical strength, contributing to more robust connections.

Maximum Supply Current: 0.000098 mA

Very low maximum supply current ensures energy efficiency, making the product suitable for battery-operated devices.

Telecom IC Type: CAN TRANSCEIVER

Designed for communication applications, the CAN transceiver type facilitates reliable data transmission in automotive or industrial networks.

Nominal Supply Voltage: 14 V

Standard nominal voltage simplifies compatibility with existing systems, making integration easier for designers.

Terminal Pitch: 0.65 mm

Tight terminal pitch accommodates more connections in limited space, enabling complex board designs.

Data Rate: 1 Mbps

A data rate of 1 Mbps supports fast communication, essential for time-sensitive data processes in automotive and industrial applications.

Technical Specifications

Network Interfaces UJA1075ATW/3V3WD,1 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000098 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1075ATW/3V3WD,1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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