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UJA1075ATW/3V3,118

NXP Semiconductors

UJA1075ATW/3V3,118 by NXP Semiconductors

UJA1075ATW/3V3,118 by NXP is a CAN transceiver designed for automotive applications, operating b/w -40 °C to 125 °C. It features a 1 Mbps data rate, operates on 4.5-28 V power supplies, and comes in a compact 32-terminal package. Ideal for reliable network interfaces in vehicles.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Rochester

USA . 3,995 parts In-Stock

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Vyrian

USA . 12,182 parts In-Stock

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Flip Electronics

USA . 3,995 parts In-Stock

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Digiode

USA . 3,572 parts In-Stock

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Anansix

USA . 1,953 parts In-Stock

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AZTECH Wire

Italy . 389 parts In-Stock

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$8.350

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One Stop Electronics

USA . 591 parts In-Stock

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$397.000

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Perfect Parts

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Microchip USA

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UNI Independent Distributors

Spain . 3,702 parts In-Stock

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Corphita

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Overview

Unlock unparalleled performance and reliability with the UJA1075ATW/3V3,118 from NXP Semiconductors. Designed for automotive applications, this advanced CAN transceiver ensures seamless communication under extreme conditions. With AEC-Q100 certification, it guarantees quality and durability, making it an ideal choice for demanding environments. Embrace efficiency and robustness in your network interfaces and elevate your projects with a trusted leader in semiconductor technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy as the package body material ensures robustness and resilience against environmental factors, enhancing long-term reliability.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration onto PCBs, making installation and assembly efficient.

Screening Level: AEC-Q100

Compliant with AEC-Q100 screening level indicates this product meets automotive quality standards, ensuring reliability in mission-critical applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB layout, allowing for efficient use of area and facilitating compact designs.

Power Supplies (V): 4.5/28

A wide operating voltage range from 4.5 to 28V provides flexibility for various applications, accommodating diverse power supply systems.

No. of Terminals: 32

With 32 terminals, this component supports multiple connections, enabling complex integrated circuit designs for advanced functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This advanced package style allows for efficient thermal management while maintaining a low profile, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C makes this component suitable for high-temperature environments, enhancing versatility in harsh conditions.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C ensures the product is reliable in extreme cold environments, expanding its range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, improving the longevity of connections in various environments.

Terminal Position: DUAL

The dual terminal position enhances signal integrity and simplifies routing on the PCB, allowing for more efficient designs.

Maximum Seated Height: 1.1 mm

A maximum seated height of just 1.1 mm enables ultra-thin designs, making it ideal for modern compact electronic devices.

Width: 6.1 mm

With a width of 6.1 mm, the component is well-suited for space-constrained applications without sacrificing performance.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows for compatibility with high-temperature soldering processes, ensuring reliability during manufacturing.

Length: 11 mm

At 11 mm in length, this device is compact yet functional, making it adaptable for various circuit configurations.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, the device is designed to withstand the rigors of automotive environments, ensuring longevity and reliability.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint reliability and provides easy access for assembly, promoting efficient manufacturing.

Maximum Supply Current: 0.000098 mA

A very low maximum supply current of 0.000098 mA ensures energy efficiency, making it suitable for battery-powered applications.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, it offers robust communication capabilities for automotive and industrial applications, ensuring reliable data transmission.

Nominal Supply Voltage: 14 V

The nominal supply voltage of 14V aligns well with standard automotive systems, ensuring compatibility and ease of integration.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm reduces overall footprint while still allowing for reliable soldering and robustness, ideal for high-density PCBs.

Data Rate: 1 Mbps

The capability of supporting a data rate of 1 Mbps ensures sufficient bandwidth for high-speed communications in various applications.

Technical Specifications

Network Interfaces UJA1075ATW/3V3,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000098 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1075ATW/3V3,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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