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UJA1075ATW/3V3,112

NXP Semiconductors

UJA1075ATW/3V3,112 by NXP Semiconductors

UJA1075ATW/3V3,112 by NXP is a robust CAN transceiver designed for automotive applications, operating b/w -40 °C to 125 °C. It features a 1 Mbps data rate and supports power supplies from 4.5V to 28V with a compact 32-terminal package. Ideal for network interfaces in vehicles, it ensures reliable communication under AEC-Q100 standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,812 parts In-Stock

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7,812

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Digiode

USA . 4,173 parts In-Stock

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4,173

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Anansix

USA . 1,676 parts In-Stock

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1,676

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Distributors (Availability)

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AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$11.640

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763

$11.640

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One Stop Electronics

USA . 1,256 parts In-Stock

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$366.000

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1,256

$366.000

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Microchip USA

USA . 8,555 parts In-Stock

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8,555

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UNI Independent Distributors

Spain . 4,495 parts In-Stock

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4,495

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Corphita

USA . 1,098 parts In-Stock

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1,098

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Overview

Unlock the potential of your automotive applications with the UJA1075ATW/3V3,112 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a CAN transceiver that ensures reliable communication under extreme conditions. With robust temperature resilience and compact design, this product not only enhances the performance of your network interfaces but also drives efficiency and longevity in your projects. Elevate your designs with trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using a durable plastic/epoxy material ensures excellent protection against environmental factors, enhancing product reliability.

Surface Mount: YES

The surface mount design allows for efficient space utilization on printed circuit boards, making it ideal for compact applications.

Screening Level: AEC-Q100

AEC-Q100 screening level compliance means this product is tested for automotive applications, ensuring high reliability and performance in critical environments.

Package Shape: RECTANGULAR

The rectangular shape contributes to design versatility and suitability for various PCB layouts.

Power Supplies (V): 4.5/28

Operates across a wide voltage range, providing flexibility for various power supply designs.

No. of Terminals: 32

With 32 terminals, this component offers a robust connection ability, catering to complex signal requirements.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enable space-effective designs, making it perfect for modern compact electronic applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in high-heat environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product is well-suited for extreme temperature conditions, ensuring consistent performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish helps prevent corrosion and improve solderability, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal position enhances connection options, providing flexibility in PCB design.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a low-profile design, ideal for applications with height restrictions.

Width: 6.1 mm

A compact width allows for better integration into tight spaces within electronic systems.

Length: 11 mm

A manageable length facilitates easy handling and placement on PCBs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring robustness and reliability in demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical connections and ease of soldering, making assembly simpler.

Maximum Supply Current: 0.000098 mA

Very low current consumption ensures energy efficiency, making it ideal for battery-powered applications.

Telecom IC Type: CAN TRANSCEIVER

Designed specifically for CAN communication networks, ensuring optimal performance in automotive and industrial applications.

Nominal Supply Voltage: 14 V

The nominal supply voltage aligns well with common automotive systems, simplifying integration.

Terminal Pitch: 0.65 mm

A standard terminal pitch allows compatibility with a wide range of board designs and layouts.

Data Rate: 1 Mbps

A high data rate of 1 Mbps ensures rapid data transmission, crucial for real-time communications in automotive applications.

Technical Specifications

Network Interfaces UJA1075ATW/3V3,112 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

4.5/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.000098 mA

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

UJA1075ATW/3V3,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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