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TEA5712TD-T

NXP Semiconductors

TEA5712TD-T by NXP Semiconductors

TEA5712TD-T by NXP Semiconductors is a compact audio single-chip receiver designed for AM/FM applications. It features a low harmonic distortion of 0.8%, a signal-to-noise ratio of 26 dB, and operates b/w 2V to 12V supply voltage. Ideal for surface mount designs, it enhances audio quality in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,971 parts In-Stock

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4,971

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Vyrian

USA . 3,824 parts In-Stock

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3,824

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Anansix

USA . 2,160 parts In-Stock

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2,160

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One Stop Electronics

USA . 1,275 parts In-Stock

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$11.800

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$11.800

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UNI Independent Distributors

Spain . 7,230 parts In-Stock

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7,230

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Corphita

USA . 358 parts In-Stock

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358

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Overview

Unlock superior audio experiences with the TEA5712TD-T from NXP Semiconductors, a leader in innovative electronic solutions. This compact, high-performance receiver IC delivers exceptional sound quality and reliability, perfect for various applications, from automotive to consumer electronics. With its low distortion and impressive signal-to-noise ratio, you can trust in crystal-clear audio. Elevate your projects with NXP’s proven technology, ensuring outstanding value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the receiver IC reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs, supporting space-efficient layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs while providing efficient heat dissipation.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As an audio single chip receiver, it simplifies design efforts by integrating necessary functions into one component, improving overall system efficiency.

Harmonic Distortion: 0.8%

A low harmonic distortion value enhances audio fidelity, ensuring high-quality sound reproduction in applications.

No. of Terminals: 32

Having 32 terminals provides versatile connectivity options, accommodating various configurations and features.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compact designs, making it suitable for space-constrained devices.

Terminal Position: DUAL

Dual terminal positioning aids in easier mounting and soldering, improving reliability during production.

Maximum Seated Height: 2.65 mm

A compact height allows for low-profile designs, making it ideal for applications where space is at a premium.

Nominal Signal to Noise Ratio (FM): 26 dB

A nominal SNR of 26 dB indicates effective noise management, resulting in clearer audio output and improved performance.

Width: 7.5 mm

With a moderate width, this IC can fit into a variety of PCB layouts while maintaining stability.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enhances energy efficiency, allowing for battery-powered applications.

Length: 20.5 mm

The length facilitates easy placement on PCBs, ensuring compatibility with various circuit designs.

Demodulation Type: AM/FM

Being capable of both AM and FM demodulation allows for versatile applications in different audio transmission systems.

Terminal Form: GULL WING

Gull wing terminals support easy mounting and automated assembly, streamlining production processes.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm is standard for most surface-mount technologies, enabling ease of integration and design flexibility.

Maximum Supply Voltage (Vsup): 12 V

A maximum supply voltage of 12 V provides the flexibility to operate in a wide range of applications without compromising performance.

Technical Specifications

Receiver ICs TEA5712TD-T attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

26 dB

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA5712TD-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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