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TDA9332H

NXP Semiconductors

TDA9332H by NXP Semiconductors

CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,763 parts In-Stock

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Anansix

USA . 2,881 parts In-Stock

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Digiode

USA . 1,313 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 253 parts In-Stock

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253

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Cyclops Electronics Ltd

UK . 62 parts In-Stock

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Q Components

USA . 4 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 792 parts In-Stock

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$9.800

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Kepictronics

USA . 5,034 parts In-Stock

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UNI Independent Distributors

Spain . 2,644 parts In-Stock

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Corphita

USA . 2,309 parts In-Stock

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Metaverse IC Inc.

Canada . 1,000 parts In-Stock

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Assy Fe

Spain . 9 parts In-Stock

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Technical Specifications

Other Function Consumer ICs TDA9332H attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

8

Qualification:

Not Qualified

Maximum Seated Height:

2.1 mm

Sub-Category:

Color Signal Converters

Maximum Supply Current:

58 mA

Maximum Supply Voltage (Vsup):

8.8 V

Minimum Supply Voltage (Vsup):

7.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

TDA9332H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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